Comparison ledger
Logitech EP1, Logitech PM5, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | EP1Logitech | PM5Logitech |
|---|---|---|
| OEM | Logitech | Logitech |
| Category | CMP | CMP |
| Wafer size | 100mm | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech EP1 | Logitech PM5 |
| Specifications | ||
| Product family | EP Polishing Pads and Cloths[1] | — |
| Application type | Chemical Mechanical Polishing (CMP)[1] | — |
| Suitable applications | oxide, nitride and copper[1] | — |
| Type | Chemical Mechanical Polishing (CMP) cloths and pads[1] | — |
| Suitable materials | Oxide, nitride and copper[1] | — |
| Product type | Chemical Mechanical Polishing (CMP) polishing cloths and pads[1] | — |
| Applications | oxide, nitride, and copper[1] | — |
| Associated wafer process capacity | up to 100mm/4"[2] | — |
| Manufacturer | — | Logitech[3] |
| Model | — | PM5[3] |
| Application | — | Polishing and lapping[3] |
| Abrasive autofeed cylinder compatibility | — | Abrasive autofeed cylinder for use with a Logitech PM5 or LP50 system[2] |
| Sample wafer size | — | 4 inch (100mm) or smaller[4] |
| Power supply voltage | — | Single phase AC100V[4] |
| Machine type | — | Lapping and polishing system[4] |
| Number of workstations | — | Single[5] |
| Wafer size | — | 100 mm (4 inches) or smaller[4] |
| Polishing plate material | — | Stainless steel[4] |
| Lapping plate material | — | Cast iron[4] |
| Sample holding method | — | Vacuum[4] |
| Variable plate speed | — | Yes[4] |
| Slurry delivery method | — | Peristaltic pump[4] |
| Roller arm assembly | — | Yes[4] |
| Emergency stop | — | Yes[4] |