Waferpedia

Comparison ledger

NSR S 307 Eversus150 e Mask

Nikon NSR S 307 E, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
150 e MaskSUSS MicroTec
OEMNikonSUSS MicroTec
CategoryLithographyLithography
Wafer sizeWafer X-Axis is out of order—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyNikon NSRSUSS MicroTec 150 e Mask
Specifications
Wafer300 mm[1]—
Exposure Light SourceArF excimer laser[1]—
Wavelength193[1]—
Resolution80 nm[2]—
Alignment Accuracy12 nm[1]—
Exposure Field26 x 33 mm[1]—
Reduction Ratio1:4[1]—
Wafer sizeWafer X-Axis is out of order[1]—
ConfigurationHard Disk, 300mm[3]—
Light SourceArF excimer laser[1]—
Lens NA0.85[2]—
Lens DataCymer XLA 140[3]—
Wafer Size Support200 mm / 300 mm[2]—
Throughput (300 mm)> 112 WPH[2]—
Throughput (200 mm)> 160 WPH[2]—

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]inventory listing