Waferpedia

Comparison ledger

100 ICP FluorineversusAct 8 Metal

Oxford Instruments 100 ICP Fluorine, Tokyo Electron Act 8 Metal, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100 ICP FluorineOxford Instruments
Act 8 MetalTokyo Electron
OEMOxford InstrumentsTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOxford Instruments 100 ICP FluorineTokyo Electron Act
Specifications
Etch GasesSF6, CF4, O2, Ar, N2, CHF3, C4F8[1]—
Cryo DRIE etch rateup to 5 µm/min[1]—
Wafer size4 inch, 6 inch, 8 inch (with clamp change)[1]—
Configuration—2 chamber DPS Metal[2]
Gas—PGMEA, HMDS, TMAH[2]
OS—Lynx[2]
Missing—TH unit sight glas, thermocon circulator, spin motor driver[2]
DPS Metal chambers—2[2]
ASP+ chambers—2[2]
Orienter/degas modules—2[2]
Operating system—Lynx[2]
Process gases—PGMEA, HMDS, TMAH[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]inventory listing