Waferpedia

Comparison ledger

100 ICP FluorineversusUnity ME 8555 SSS Dry

Oxford Instruments 100 ICP Fluorine, Tokyo Electron Unity ME 8555 SSS Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
100 ICP FluorineOxford Instruments
Unity ME 8555 SSS DryTokyo Electron
OEMOxford InstrumentsTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOxford Instruments 100 ICP FluorineTokyo Electron Unity
Specifications
Etch GasesSF6, CF4, O2, Ar, N2, CHF3, C4F8[1]—
Cryo DRIE etch rateup to 5 µm/min[1]—
Wafer size4 inch, 6 inch, 8 inch (with clamp change)[1]8 inch[2]
Configuration—3 Ch Oxide[2]
Manufacturer—Tokyo Electron[3]
Model—Unity ME 8555 SSS[2]
Tool type—Dry Etcher[2]
Software version—1.00[2]
Condition note—Missing parts[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com