Waferpedia

Comparison ledger

6500versus10490

Palomar 6500, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
6500Palomar
10490West Bond
OEMPalomarWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyPalomar 6500West Bond 10490
Specifications
Machine typeDie bonder[1]—
Positioning systemFour-axis positioning system[1]—
Drive mechanismLinear motors gliding over air bearings[1]—
FrameSteel based frame[1]—
Placement capabilityUltra-high accuracy eutectic and adhesive placements[1]—
Cycle timeUnder seven seconds[1]—
Cycle TimeUnder 7 seconds[1]—
Placement AccuracyUltra-high[1]—
Positioning AxesFour-axis[1]—
Drive SystemLinear motors with air bearings[1]—
Frame MaterialSteel[1]—
Supported ProcessesSilver Sintering Die Bonding, Eutectic Die Bonding, Epoxy Die Bonding, UV Die Bonding, Solder Paste Die Bonding[2]—
Manufacturer—West Bond[3]
Model—10490[3]
Description—Convertible bonder, wedge to ball[4]
Tool type—Convertible bonder[5]
Bonding modes—Wedge bonding and ball bonding[5]
Use—Wire bonding[5]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org
  3. [3]Equipment inventory listing
  4. [4]fabsurplus.comfabsurplus.com
  5. [5]waferpedia.comwaferpedia.com