Comparison ledger
Perkin Elmer 4400, Perkin Elmer 4410, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 4400Perkin Elmer | 4410Perkin Elmer |
|---|---|---|
| OEM | Perkin Elmer | Perkin Elmer |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Perkin Elmer 44xx | Perkin Elmer 44xx |
| Specifications | ||
| Handler Type | Manual[1] | — |
| Configuration | Pump Exhaust GEEX[1] | Eratron PPS 8210 Plasma Power Supply[5] |
| CDA | 60-80 psi[1] | — |
| Chilled Water | 68 F, 2 gpm[1] | — |
| N2 | 50 psi[1] | — |
| HPN2 | 60 psi[1] | — |
| HPAr | 10 psi[1] | — |
| O2 | 10 psi[1] | — |
| Power | 208 V, 3 Phase, 60 A[1] | — |
| Process Type | Sputtering / Physical Vapor Deposition[3] | — |
| Wafer Size | 6 inch[4] | Small~8 inch[7] |
| Sputtering Types | DC, RF, DC-RF bias capable[2] | — |
| Target Positions | Ports for four targets; three utilized (two DC with RF bias, one RF)[2] | — |
| Load Lock | Yes[2] | — |
| RF Etch Option | Yes[2] | — |
| Pump - Main Chamber | Cryotorr 8 cryopump with CTI SC (air-cooled) He compressor[2] | — |
| Pump - Load Lock | Pfeiffer turbopump backed by Trivac rotary vane pump[2] | — |
| Roughing Pump | Ebara A10 roots pump[2] | — |
| Power Supply | Present[1] | Eratron PPS 8210 Plasma Power Supply[5] |
| AC Distribution Box | Present[1] | — |
| Heat Exchanger / Chiller | Present[1] | — |
| Backing Pump | Present[1] | — |
| Cryo Compressor | Present[1] | — |
| Mechanical Pump | Present[1] | — |
| CDA Supply | 60-80 psi[1] | — |
| Chilled Water Supply | 68 F, 2 gpm[1] | — |
| N2 Supply | 50 psi[1] | — |
| HPN2 Supply | 60 psi[1] | — |
| HPAr Supply | 10 psi[1] | — |
| O2 Supply | 10 psi[1] | — |
| Power Requirement | 208 V, 3 Phase, 60 A[1] | — |
| Pump Exhaust | GEEX[1] | — |
| GEM / SECS | Present[1] | — |
| Cables | All cables present[1] | — |
| Standard Manual | Included[1] | — |
| CE Mark | No[1] | — |
| Vintage | 2004[1] | — |
| Equipment type | Sputtering system[3] | — |
| Target ports | Four target ports[2] | — |
| Process modes | DC and RF, with DC-RF bias capable[2] | — |
| Options | RF etch option[2] | — |
| Load lock | Load lock[2] | — |
| Type | — | Sputtering Deposition System[6] |
| Manufacturer | — | Perkin-Elmer (Ultek Division)[6] |
| Model | — | 4410 (DeltaTM Cathode Production Sputtering System)[6] |
| Process Chamber | — | Load lock[7] |
| Key Features | — | Process proven for III-V substrates; Non-PLC (smaller footprint / easy maintenance); 20 years proven sputter technology; Process data and recipe storage on a hard drive; Easy TC vacuum gauge calibration; Positioning Deposition (optional); GEM/SEC II functions (optional)[7] |
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