Waferpedia

Comparison ledger

ACP28GversusATH1603M

Pfeiffer ACP28G, Pfeiffer ATH1603M, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ACP28GPfeiffer
ATH1603MPfeiffer
OEMPfeifferPfeiffer
CategoryDepositionDeposition
Wafer size100mm100mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyPfeiffer ACP28GPfeiffer ATH1603M
Cited variants—
  • Y2662100[1]
  • Y2522100[2]
  • Y25231L0[3]
  • TE5231B1[4]
  • ATH1603M (DN250)[1]
  • ATH1603M (DN200) with MAGPOWER controller[5]
Specifications
Pump typeDry pump[6]—
RoleLoadlock primary pump[6]Turbo pump[6]
ManufacturerPfeiffer[6]—
Contextual systemEVA 451 evaporator[6]—
Intended applicationPumping traces of corrosive gas[7]—
Pumping mechanismFrictionless multi-stage roots design[7]—
Voltage range90 to 254 VAC at 50 or 60 Hz[7]—
Overhaul interval22,000 hours[7]—
System location—Chamber secondary pump[6]
Associated system—EVA 451 thermal evaporator[6]
Supported wafer sizes in associated system—100 mm wafers; 150 mm wafers[6]
Pumping speed (N₂)—approx. 1,400–1,600 l/s[1]
Ultimate pressure—up to approx. 6 × 10⁻⁹ mbar[1]
Rated speed—39,000 rpm[1]
Bearing type—Magnetic bearing (MagLev)[1]
Cooling—Water-cooled[1]
Inlet flange—DN250 ISO-F (with protective grille) / DN200 ISO-F[1]
Outlet flange—KF40 (NW40, ISO-KF40)[1]
Motor parameters—44 Vrms, 1,300 Hz, 7 Arms[5]
Controller—External electronics required (e.g., MAGPOWER controller)[5]
Bearing—Magnetic bearing[1]
Motor voltage—44 Vrms[1]
Motor frequency—1,300 Hz[1]
Motor current—7 Arms[1]
Country of origin—France[4]
Inlet flange (alternate)—200 CF-F[2]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]lagerwerk.comlagerwerk.com
  2. [2]idealvac.comidealvac.com
  3. [3]idealvac.comidealvac.com
  4. [4]semiconductorspares.comsemiconductorspares.com
  5. [5]lagerwerk.comlagerwerk.com
  6. [6]epfl.chepfl.ch
  7. [7]idealspectroscopy.comidealspectroscopy.com