Waferpedia

Comparison ledger

ATH1603Mversus310

Pfeiffer ATH1603M, STS 310, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ATH1603MPfeiffer
310STS
OEMPfeifferSTS
CategoryDepositionDeposition
Wafer size100mm100mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyPfeiffer ATH1603MSTS 310
Cited variants
  • Y2662100[1]
  • Y2522100[2]
  • Y25231L0[3]
  • TE5231B1[4]
  • ATH1603M (DN250)[1]
  • ATH1603M (DN200) with MAGPOWER controller[5]
—
Specifications
RoleTurbo pump[6]—
System locationChamber secondary pump[6]—
Associated systemEVA 451 thermal evaporator[6]—
Supported wafer sizes in associated system100 mm wafers; 150 mm wafers[6]—
Pumping speed (N₂)approx. 1,400–1,600 l/s[1]—
Ultimate pressureup to approx. 6 × 10⁻⁹ mbar[1]—
Rated speed39,000 rpm[1]—
Bearing typeMagnetic bearing (MagLev)[1]—
CoolingWater-cooled[1]—
Inlet flangeDN250 ISO-F (with protective grille) / DN200 ISO-F[1]—
Outlet flangeKF40 (NW40, ISO-KF40)[1]—
Motor parameters44 Vrms, 1,300 Hz, 7 Arms[5]—
ControllerExternal electronics required (e.g., MAGPOWER controller)[5]—
BearingMagnetic bearing[1]—
Motor voltage44 Vrms[1]—
Motor frequency1,300 Hz[1]—
Motor current7 Arms[1]—
Country of originFrance[4]—
Inlet flange (alternate)200 CF-F[2]—
Tool type—plasma-enhanced chemical-vapor-deposition (PECVD) system[7]
Wafer size—100-mm-diameter silicon wafers[7]
Deposition material—silicon dioxide[7]
Process—Plasma-enhanced chemical vapor deposition (PECVD)[7]
Wafer Size—100 mm[7]
Deposited Materials—Silicon dioxide (oxide) and silicon nitride (SiNx)[7]
Oxide Recipe Details—2% SiH4 in Ar at 400 sccm, N2O at 900 sccm, 60 W at 13.56 MHz, 650 mtorr, 300 °C[7]
Nitride Recipe (Low RI) Details—2% SiH4 in Ar at 200 sccm, N2 at 2000 sccm, power alternating between 30 W at 13.56 MHz for 6 s and 25 W at 187 kHz for 3 s, 650 mtorr, 300 °C[7]
Nitride Recipe (High RI) Modification—Increase 2% SiH4/Ar flow to 500 sccm[7]
Temperature—300 °C[7]
Pressure—650 mtorr[7]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]lagerwerk.comlagerwerk.com
  2. [2]idealvac.comidealvac.com
  3. [3]idealvac.comidealvac.com
  4. [4]semiconductorspares.comsemiconductorspares.com
  5. [5]lagerwerk.comlagerwerk.com
  6. [6]epfl.chepfl.ch
  7. [7]nanocenter.umd.edunanocenter.umd.edu