Comparison ledger
SUSS MicroTec SB6 / 8 Gen2, SUSS MicroTec XB8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | SB6 / 8 Gen2SUSS MicroTec | XB8SUSS MicroTec |
|---|---|---|
| OEM | SUSS MicroTec | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | Gen2 | — |
| Family | SUSS MicroTec SB6 / 8 Gen2 | SUSS MicroTec XB8 |
| Specifications | ||
| Wafer size | up to 200 mm[1] | — |
| Automation | Semi-automated[1] | Semi-automated[1] |
| Wafer size (max) | — | 200 mm[1] |
| Process | — | High-Force Wafer Bonding[1] |
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