Waferpedia

Comparison ledger

10490versus7400A

West Bond 10490, West Bond 7400A, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10490West Bond
7400AWest Bond
OEMWest BondWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyWest Bond 10490West Bond 7400A
Cited variants—
  • West-Bond 7400A 90° Vertical Feed Deep Access Manual Wedge Wire Bonder[1]
  • West-Bond 7400A Ultrasonic 45° Feed Wedge Wire Bonder[1]
  • West-Bond 7400A Ultrasonic 60° Feed Wedge Wire Bonder[1]
  • West-Bond 7400A Ultrasonic 90° Feed Deep Access Wedge Wire Bonder[1]
  • West-Bond 7400A-26-44B-45[2]
Specifications
ManufacturerWest Bond[3]—
Model10490[3]—
DescriptionConvertible bonder, wedge to ball[4]—
Tool typeConvertible bonder[5]—
Bonding modesWedge bonding and ball bonding[5]—
UseWire bonding[5]—
Equipment type—Manual wedge wire bonder[1]
Configuration—90° vertical feed deep access manual wedge wire bonder[1]
Bonding Type—Ultrasonic wedge wire bonding[6]
Wire Diameter Range—0.7 mil (18 microns) to 4 mil (100 microns), and larger with added features[6]
Feed Angle Options—45°, 60°, 90°[1]
Manipulator Type—Single-lever X-Y-Z manipulator[6]
Wire Feed—Independent wire feed and work-sensing tool[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]semistarcorp.comsemistarcorp.com
  2. [2]ntc-tech.comntc-tech.com
  3. [3]Equipment inventory listing
  4. [4]fabsurplus.comfabsurplus.com
  5. [5]waferpedia.comwaferpedia.com
  6. [6]jmind.comjmind.com