Applied Materials Endura

Models in this family

1. 

   Endura

   The Applied Materials Endura is a physical vapor deposition (PVD) system for semiconductor manufacturing, supporting wafer sizes from 6 to 12 inches and configured with various process chambers for metals such as copper, gold, titanium tungsten, and nickel.

2. Endura 1

   The Applied Materials Endura 1 is a 12-inch wafer metal processing tool.

3. 

   Endura 2

   Applied Materials Endura 2 is a 12-inch PVD (physical vapor deposition) system used for liner/barrier and front-end metallization applications.

4. 

   Endura 2 Chambers

   Applied Materials Endura 2 Chambers is a semiconductor equipment item with Chamber A without heater, Chamber B with heater, and Chamber C without heater.

5. 

   Endura 4.0

   Applied Materials Endura 4.0 is a PVD (Physical Vapor Deposition) system with 25-wafer FOUP loadports.

6. 

   Endura CL

   The Applied Materials Endura CL is a semiconductor processing chamber offered in Preclean, Degas STD, and ESIP TAN (No Target) configurations.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Preclean	—	2002	—	Equipment inventory listing[1]
   ESIP TAN (No Target)	—	—	—	Equipment inventory listing[2]
   Degas STD	—	—	—	Equipment inventory listing[3]
   ESIP TAN	—	—	ESIP TAN chamber without target	Equipment inventory listing[2]

7. Endura CL Versa

   The Applied Materials Endura CL Versa is a physical vapor deposition system from the Endura family, configured with TTN 3CH + Degas STD 2CH.

8. 

   Endura HP

   Applied Materials Endura HP is a PVD sputter physical vapor deposition system.

Sources