Esec Datacon 2200 evo advanced

Models in this family

1. Datacon 2200 evo advanced3rd generation

   The Esec Datacon 2200 evo advanced is a die bonder for epoxy die attach applications. The Esec Datacon 2200 evo advanced is described as a flexible 300 mm high-speed platform with wafer sizes from 4 inches to 12 inches on 8-inch or 12-inch wafer frames.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Datacon 2200 evo	—	—	—	besi.com[1]
   Datacon 2200 evo plus	—	—	—	besi.com[1]
   Datacon 2200 evo hF	—	—	—	besi.com[1]
   Datacon 2200 evo hS	—	—	—	besi.com[1]
   Datacon 2200 evo advanced	—	—	—	besi.com[1]

Sources