Tool family
The Esec Datacon 2200 evo plus is a die bonder for epoxy die attach applications. The Esec Datacon 2200 evo plus is specified for 4-inch to 12-inch wafers on 8-inch or 12-inch wafer frames.
The Esec Datacon 2200 evo plus is a die bonder for epoxy die attach applications. The Esec Datacon 2200 evo plus is specified for 4-inch to 12-inch wafers on 8-inch or 12-inch wafer frames.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Datacon 2200 evo advanced | — | — | Offers ± 3 µm @ 3s placement accuracy, ± 0.07° @ 3s rotational accuracy, and a new vision, optics, and camera system. | besi.com[1] |
| Datacon 2200 evo | — | — | Base platform with integrated dispenser, 12" wafer handling, automatic tool changer, and application-specific tooling. | besi.com[2] |