Tool family
STS Multiplex
Models in this family
The STS Multiplex is a PECVD deposition system for 6-inch wafers, processing silicon nitride with gases including oxygen, carbon tetrafluoride, silane, nitrous oxide, and ammonia.
The STS Multiplex ASE ICP Deep Silicon Etcher is a low- and high-frequency ICP etch system for deep silicon trench etching of a single 6-inch substrate.
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- MultiplexSTS
The STS Multiplex is a PECVD deposition system for 6-inch wafers, processing silicon nitride with gases including oxygen, carbon tetrafluoride, silane, nitrous oxide, and ammonia.
CategoryDeposition19 specs - Multiplex ASE ICP Deep SiliconSTS
The STS Multiplex ASE ICP Deep Silicon Etcher is a low- and high-frequency ICP etch system for deep silicon trench etching of a single 6-inch substrate.
CategoryEtchWaferManual wafer lock5 specs