Accretech
The Accretech / TSK UF 3000 is an automatic wafer prober. The UF 3000 supports 8-inch and 12-inch wafers. The UF 3000 includes a 300mm chuck and operates on single-phase 115 Vac power.[1][2]

Plate 01TSK UF3000 PROBER WAFER DUMMY TEST
Plate 02ACCRETECH UF3000 WAFER DUMMY TEST VIDEO(F240124FB)
Plate 03UF3000 ACCRETECH/TSK Wafer Prober System
Plate 04UF3000 TSK/ACCRETECH Wafer Prober System
A wafer prober positions a semiconductor wafer so probe needles can contact selected sites for electrical testing. An automatic wafer prober typically combines wafer handling, precise motion stages, and probe alignment to repeat test contacts across many die locations.
A wafer prober in this class serves as the interface between wafer-level test instrumentation and the wafer under test. The machine holds the wafer on a chuck, moves it to the required position, and supports probe contact so electrical measurements can be taken before downstream assembly.
Documented failure modes, common issues, and field considerations.
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The primary function is to automatically position a semiconductor wafer and make temporary electrical contact with each die's bond pads via a probe card, enabling electrical testing of the die before they are separated from the wafer.
Tests can include DC parametric measurements, functional logic tests, memory tests, and analog/mixed-signal checks, depending on the device type and the test system connected to the probe card.
Routine maintenance includes cleaning the chuck and probe tips, calibrating the alignment system, and verifying the mechanical accuracy of the chuck movement to maintain contact repeatability and avoid damage to wafers or probes.
The following facts about the UF 3000 Automatic Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UF 3000 Automatic Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UF 3000 Automatic Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UF 3000 Automatic Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the UF 3000 Automatic Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the UF 3000 Automatic Wafer are on record.
Answerable by: an OEM parts catalog or a service engineer
Last updated Oct 11, 2026.
The Electroglas EG 4090 u+ is a prober for 8-inch wafers.
The Teradyne / Eagle ETS 200 T is a tester that is used with an Electroglas EG 4090 prober for 8-inch wafers.
The Semics Opus 3 is a prober for semiconductor wafers, supporting 8 and 12 inch wafer sizes.
Tokyo Electron Precio Octo is a prober with source-stated wafer sizes ranging from 4 inch to 8 inch.