Waferpedia

Aixtron

G 5 Plus

DepositionAixtron G 5 Plus family
Research Quality: 50% complete

The Aixtron G 5 Plus is a GaN epitaxy deposition system that supports 6-inch and 8-inch wafer sizes. The Aixtron G 5 Plus is a metal-organic chemical vapor deposition (MOCVD) system for compound semiconductors. The Aixtron G 5 Plus uses a planetary reactor module and operates as a batch reactor.[1]

G 5 Plus — Inventory photo
Fig. 01G 5 PlusInventory photo[2]

Power

208 VAC[1]

Vacuum

max. 6barg[2]

Gas delivery

Horiba MFC's[1]

What it is

The Aixtron G 5 Plus is a metal-organic chemical vapor deposition (MOCVD) system for compound semiconductors. The system is designed for gallium nitride (GaN) epitaxy on substrates including silicon, sapphire, and silicon carbide. The G 5 Plus uses a planetary reactor module and supports wafer sizes of 150 mm and 200 mm.[3][1][2]

How it works

The G 5 Plus operates as a batch reactor with a planetary susceptor that rotates wafers to achieve uniform film thickness, composition, and dopant concentration. The reactor employs a warm ceiling design to minimize thermal gradients and wafer curvature, enabling the use of standard-thickness silicon wafers. The system features a cassette-to-cassette wafer handler and chlorine-based in-situ cleaning. Gas delivery includes a Penta Injector module and Horiba mass flow controllers. Process gases used include hydrogen, nitrogen, ammonia, and chlorine; metalorganic sources include trimethylgallium, trimethylaluminium, and Cp2Mg. The operating pressure inside the system is maximum 6 barg.[3][1][2]

Where it fits in the process flow

General reference — not yet source-verified

MOCVD systems such as the G 5 Plus are used in the front-end of line for epitaxial deposition of compound semiconductor layers. The tool sits after substrate cleaning and preparation, depositing the active device layers before subsequent photolithography, etching, and metallization steps. The G 5 Plus is typically employed in fabs producing GaN-based devices for optoelectronics, power electronics, and RF applications.

Applications

The G 5 Plus is applied to gallium nitride deposition on silicon, sapphire, and silicon carbide substrates. The platform supports advanced GaN applications on 150 mm and 200 mm substrates, and is used for producing high-electron-mobility transistors, light-emitting diodes, and power devices.[3][1]

What do the numbers mean?

Power & electrical2

Process module voltage
208 VAC[1]
Accurate?
RF generator voltage
480 VAC[1]
Accurate?

Vacuum & pumping4

Operating pressure inside system
max. 6barg[2]
Accurate?
Operating pressure (max)
6 barg[2]
Accurate?
Exhaust
Single filter exhaust CT500[1]
Accurate?
Process pump
Ebara ESA80[1]
Accurate?

Wafer handling8

Wafer sizes
6, 8 inch[2]
Accurate?
Substrate sizes
150 mm, 200 mm[3]
Accurate?
Wafer handler
cassette-to-cassette[3]
Accurate?
Substrate types
Si, Sapphire, SiC[1]
Accurate?
Wafer sizes
6 inch, 8 inch[2]
Accurate?
Wafer configuration
8x150 mm, 5x200 mm[3]
Accurate?
Applications
GaN epitaxy on silicon, sapphire, and silicon carbide substrates[2]
Accurate?
Applications
Gallium nitride deposition on silicon, sapphire, and silicon carbide substrates[1]
Accurate?

Gas & chemistry2

Gas interfaces with maximum ventilation limit[2]
Accurate?
Mass flow controllers
Horiba MFC's[1]
Accurate?

Control & software2

Software version
Aixact 7.1.2.8[1]
Accurate?
Control system
EpiTT version 1[1]
Accurate?

Configuration & options23

GaN Epitaxy 6"/8" Bridge[2]
Accurate?
N2[2]
Accurate?
H2
300slm[2]
Accurate?
NH3
100 slm[2]
Accurate?
SiH4 / H2  ≤ 2%  5slm[2]
Accurate?
C2H4
5 slm[2]
Accurate?
Cl2
3slm[2]
Accurate?
N2 tech[2]
Accurate?
Ar[2]
Accurate?
H2 flow (max)
300 slm[2]
Accurate?
NH3 flow (max)
100 slm[2]
Accurate?
SiH4/H2 (≤2%) flow
5 slm[2]
Accurate?
C2H4 flow
5 slm[2]
Accurate?
Cl2 flow
3 slm[2]
Accurate?
Reactor type
Planetary reactor module[3]2 sources
Accurate?
Configurations
8x150 mm, 5x200 mm[3]
Accurate?
In-situ cleaning
Cl2 in-situ cleaning[3]
Accurate?
Injector
Penta Injector[1]
Accurate?
OEM
Aixtron[2]
Accurate?
Model
G 5 Plus[2]
Accurate?
Category
Deposition[1]
Accurate?
Tool type
MOCVD system for compound semiconductors[1]
Accurate?
Operation
Batch reactor[1]
Accurate?
Interested in this tool?
Need help with this tool?Embed spec card

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationGas interfaces with maximum ventilation limit[2]
  • Operating pressure inside systemmax. 6barg[2]
  • Operating pressure (max)6 barg[2]
  • Process module voltage208 VAC[1]
  • RF generator voltage480 VAC[1]
  • ExhaustSingle filter exhaust CT500[1]
  • Process pumpEbara ESA80[1]
  • Mass flow controllersHoriba MFC's[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

How does an MOCVD system achieve uniform layer thickness across a wafer?General reference — not yet source-verified

Uniformity is achieved through carefully engineered gas injection, rotation of the susceptor or substrate, precise temperature control, and optimized chamber geometry. Together these features ensure that all regions of the wafer receive equivalent precursor flux and thermal exposure.

What are typical maintenance considerations for MOCVD systems?General reference — not yet source-verified

Routine maintenance includes cleaning deposition residues from the reaction chamber, replacing susceptible parts such as susceptor and liners, and verifying mass flow controllers and gas delivery lines. Preventive maintenance intervals are typically defined by accumulated process time and the specific precursor chemistry used.

What gases and safety systems are required for MOCVD operation?General reference — not yet source-verified

MOCVD systems use toxic and pyrophoric precursor gases, so they are equipped with gas detection, exhaust scrubbers, interlocks, and strict venting protocols. Facility safety infrastructure must accommodate these hazardous process gases.

Not publicly documented

The following facts about the G 5 Plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the G 5 Plus are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the G 5 Plus are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the G 5 Plus are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the G 5 Plus are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the G 5 Plus is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]waferpedia.com — waferpedia.comwaferpedia.com
  2. [2]Inventory photo
  3. [3]aixtron.com — aixtron.comaixtron.com
Was this page accurate?

Last updated Oct 12, 2026.

Compare with similar tools

View all →