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AJA

300

DepositionAJA 300 family
Research Quality: 60% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The AJA 300 is a 300 amp water cooled thermal evaporation source used in AJA thermal evaporation systems.[1][2][3]

300 — web.archive.org
Fig. 01300web.archive.org[1]

What it is

General reference — not yet source-verified

The AJA 300 is a physical vapor deposition (PVD) system that uses magnetron sputtering to deposit thin films of metals, dielectrics, and other materials onto substrates. Machines of this class are typically configured as load-locked or batch systems, offering precise control over film thickness and uniformity in a vacuum environment.

How it works

General reference — not yet source-verified

In magnetron sputtering systems like the AJA 300, a target material is bombarded by energetic ions from a plasma, causing atoms to be ejected and deposited onto a substrate. A magnetic field confines the plasma near the target, increasing sputter rate and reducing substrate heating. The process occurs in a vacuum chamber with controlled gas flow (usually argon) and often multiple target sources for co-deposition or multilayer films.

Applications

General reference — not yet source-verified

Common applications include depositing conductive layers (such as electrodes or interconnects), magnetic films, optical coatings, and protective layers in microelectronics, photovoltaics, and sensors.

  • Thermal evaporation

What do the numbers mean?

Power & electrical2

Source type
300 amp water-cooled thermal evaporation source[1]
Accurate?
Current Rating
300 amp[1]
Accurate?

Dimensions & facilities1

Cooling
Water cooled[1]
Accurate?

Configuration & options2

Associated system type
Thermal Evaporation Systems[1]
Accurate?
Manufacturer
AJA International, Inc.[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Source type300 amp water-cooled thermal evaporation source[1]
  • Current Rating300 amp[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What types of materials can be deposited with a magnetron sputtering system?General reference — not yet source-verified

Such systems can deposit a wide range of materials, including metals, alloys, oxides, nitrides, and other compounds, depending on the target material and process gases used.

What is the typical substrate size for a research-grade sputter tool?General reference — not yet source-verified

Machines in this class generally accommodate substrates ranging from small pieces to wafers several inches in diameter, often with manual or automated handling.

How is film thickness controlled in a sputtering system?General reference — not yet source-verified

Thickness is controlled by deposition rate and time, monitored via quartz crystal microbalances or optical sensors, and calibrated for specific target-substrate distances.

Can the system deposit multilayer films without breaking vacuum?General reference — not yet source-verified

Yes, many such tools are equipped with multiple target sources and shutters, allowing sequential or co-deposition of different materials in a single pumpdown.

Not publicly documented

The following facts about the 300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 300 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 300 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 300 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 300 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 300 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]Thin Film Deposition Sputtering Manufacturer — web.archive.orgweb.archive.org
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Last updated Oct 4, 2026.

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