Waferpedia

Applied Materials

Centura Ultima+ HDP

DepositionApplied Materials Centura family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

Centura Ultima+ HDP — Inventory photo
Fig. 01Centura Ultima+ HDPInventory photo[1]

Power

Ch A – Ultima+ (ENI AM200 RF Generator)[1]

Vacuum

Stepper Turbo Throttle Valve with 3 veins[2]

Gas delivery

Ceramic gas nozzles[2]

What it is

The Centura Ultima+ HDP is a high-density plasma chemical vapor deposition (CVD) system manufactured by Applied Materials. The system is designed for 200 mm and 300 mm wafer processing.[1][2]

How it works

The Ultima HDP system features dual RF coils for gap-fill capability across the wafer. The system uses an electrostatic chuck for wafer clamping and temperature control. Remote plasma cleaning is employed for chamber maintenance.[2]

Where it fits in the process flow

General reference — not yet source-verified

In the semiconductor fabrication flow, HDP CVD deposition typically follows the formation of transistor structures for STI fill, and later for dielectric layers between metal interconnects. The void-free gapfill is critical for sub-micron nodes.

Applications

The Centura Ultima+ HDP deposits undoped and doped dielectric films for a range of applications including shallow trench isolation, pre-metal dielectric, inter-level dielectric, inter-metal dielectric, and passivation.[2]

What do the numbers mean?

Power & electrical3

Ch A – Ultima+ (ENI AM200 RF Generator)[1]
Accurate?
RF Generator (Ch A)
ENI AM200[1]
Accurate?
RF Generators
Top, Side, and Bias[2]
Accurate?

Vacuum & pumping5

Vacuum System - Throttle Valve
Stepper Turbo Throttle Valve with 3 veins[2]
Accurate?
Vacuum System - Gate Valve
Pendulum Gate Valve[2]
Accurate?
Vacuum System - Turbo Pump
Present[2]
Accurate?
Endpoint Detector
Foreline FTIR[2]
Accurate?
Foreline
Heater Jacketed[2]
Accurate?

Wafer handling4

Wafer Size (Ultima+ HDP)
6 inch[1]
Accurate?
Wafer Size (Platform support)
200mm and 300mm[2]
Accurate?
Electrostatic Chuck
Ceramic with backside He, water cooling, wafer temperature monitor[2]
Accurate?
Factory Interface Robot
Kawasaki[2]
Accurate?

Gas & chemistry3

Gas Ring
Ceramic gas nozzles[2]
Accurate?
Center Gas Nozzle/Baffle
Present[2]
Accurate?
Gas Boxes
15 stick AP Gas Boxes (incl. Methane line)[2]
Accurate?

Configuration & options7

Ch E – Multi-slot cooldown[1]
Accurate?
Multi-slot cooldown (Ch E)
Present[1]
Accurate?
Platform & Chamber Model
Centura Ultima[2]
Accurate?
Process Chambers
2[2]
Accurate?
Remote Plasma Source
MKS iAstron[2]
Accurate?
Load Ports
2[2]
Accurate?
Mainframe
4.0 with metal buffer lid[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationCh A – Ultima+ (ENI AM200 RF Generator)[1]
  • RF Generator (Ch A)ENI AM200[1]
  • Gas RingCeramic gas nozzles[2]
  • Center Gas Nozzle/BafflePresent[2]
  • RF GeneratorsTop, Side, and Bias[2]
  • Vacuum System - Throttle ValveStepper Turbo Throttle Valve with 3 veins[2]
  • Vacuum System - Gate ValvePendulum Gate Valve[2]
  • Vacuum System - Turbo PumpPresent[2]
  • Gas Boxes15 stick AP Gas Boxes (incl. Methane line)[2]
  • Endpoint DetectorForeline FTIR[2]
  • ForelineHeater Jacketed[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

How does the system achieve void-free gapfill?

The system uses dual RF coils to generate a high-density plasma, along with an electrostatic chuck for precise temperature control, enabling void-free gapfill of high-aspect-ratio features.[2]

What type of cleaning method does the system use?

The system uses remote plasma cleaning.[2]

Does the system support doped films?

Yes, the system deposits both undoped and doped films.[2]

Not publicly documented

The following facts about the Centura Ultima+ HDP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura Ultima+ HDP are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Centura Ultima+ HDP are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Centura Ultima+ HDP are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Centura Ultima+ HDP are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Centura Ultima+ HDP is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]media-moov-co.s3.us-west-1.amazonaws.com — media-moov-co.s3.us-west-1.amazonaws.commedia-moov-co.s3.us-west-1.amazonaws.com
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Last updated Aug 14, 2026.

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