Waferpedia

Applied Materials

UVision 3

Produced 2007–Applied Materials UVision 3 family
Research Quality: 30% complete

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Produced

2007–

Optics

20 nm[1]

How it works

The UVision 3 operates by scanning a wafer with multiple deep ultraviolet laser beams. The system triples the number of laser beams compared to earlier versions, which enables a throughput increase. A photo-multiplier tube (PMT) detects the light scattered or reflected from the wafer surface, capturing signals that indicate the presence of defects.[1]

What do the numbers mean?

Wafer handling1

Type
DUV Brightfield wafer inspection tool[1]
Accurate?

Optics & imaging3

Defect sensitivity
20 nm[1]
Accurate?
Laser architecture
Multi-beam DUV laser (triples the number of laser beams)[1]
Accurate?
Imaging modes
Two new imaging modes extending sensitivity to 20 nm[1]
Accurate?

Performance1

Throughput improvement
40% faster than any competitive brightfield inspection tool[1]
Accurate?

Configuration & options1

Defect classification
Flexible automatic defect classification engine[1]
Accurate?

Vintage & configurations

  1. 2007-11-26Introduction[1]

    Unveiled on November 26, 2007 as the industry's highest productivity DUV brightfield wafer inspection tool.

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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What is the throughput of the UVision 3 compared to other brightfield inspection tools?

The UVision 3 delivers 40% faster throughput than any competitive brightfield inspection tool.[1]

What defect detection sensitivity does the UVision 3 offer?

The UVision 3 offers 20nm sensitivity needed for advanced immersion lithography.[1]

What technology is used in the UVision 3 for illumination?

The UVision 3 uses a multi-beam DUV (deep ultraviolet) laser architecture.[1]

Does the UVision 3 support immersion lithography processes?

Yes, the UVision 3 addresses the contrast versatility required for immersion lithography with new brightfield imaging modes.[1]

What is the target application for the UVision 3 in terms of technology node?

The UVision 3 is designed for 45nm and below double patterning and advanced FEOL applications.[1]

Not publicly documented

The following facts about the UVision 3 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented variants, configuration options, or revision breakpoints of the UVision 3 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the UVision 3 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the UVision 3 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the UVision 3 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the UVision 3 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]nanotech-now.com — nanotech-now.comnanotech-now.com
  2. [2]Equipment inventory listing
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Last updated Sep 22, 2026.

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