Waferpedia

Applied Materials

UVision SP 200 Brightfield Wafer

Applied Materials UVision SP 200 Brightfield Wafer is a brightfield wafer inspection tool for 12-inch wafers. Applied Materials UVision SP 200 Brightfield Wafer scans a wafer in a meander path. Applied Materials UVision SP 200 Brightfield Wafer uses a laser light source at 266 nm.[1][2]

UVision SP 200 Brightfield Wafer — Inventory photo
Fig. 01UVision SP 200 Brightfield WaferInventory photo[1]

Wafer size

Tool scans a wafer in a meander path

Power

3 Phase[1]

Optics

Laser ( 266 ג =nm)[1]

What it is

The Applied Materials UVision SP 200 is a brightfield wafer inspection tool for metrology and inspection.[1][2]

The UVision SP 200 is configured for 12-inch wafers.[1][2]

How it works

The UVision SP 200 scans a wafer in a meander path.[1][2]

The UVision SP 200 can use reflected brightfield and scattered greyfield signals in parallel for detection.[1][2]

Where it fits in the process flow

The UVision SP 200 is designed to inspect pattern wafers and can also inspect bare and unpatterned wafers.[1][2]

Applications

The UVision SP 200 is used for defect inspection on pattern wafers.[1][2]

The UVision SP 200 can inspect bare and unpatterned wafers as well as pattern wafers.[1][2]

The UVision SP 200 supports die-to-die comparison and cell-to-cell comparison.[1][2]

What do the numbers mean?

Power & electrical4

Phase
3 Phase[1]
Accurate?
50/60 Hz[1]
Accurate?
Power
3 Phase[1]
Accurate?
Frequency
50/60 Hz[1]
Accurate?

Wafer handling8

Designed to inspect pattern wafers, but it can also inspect bare and unpatterned wafers[1]
Accurate?
Wafer size
Tool scans a wafer in a meander path[1]
Accurate?
On pattern wafers capable of detecting defects of 25 nm with 90 %[1]
Accurate?
Tool type
Brightfield wafer inspection tool[1]
Accurate?
Wafer size
12 inch[1]
Accurate?
Wafer path
Tool scans a wafer in a meander path[2]
Accurate?
Inspection capability
Designed to inspect pattern wafers, bare wafers, and unpatterned wafers[1]
Accurate?
Defect detection
On pattern wafers capable of detecting defects of 25 nm with 90% capture rate[1]
Accurate?

Optics & imaging2

Ligth source
Laser ( 266 ג =nm)[1]
Accurate?
Light source
Laser (266 nm)[1]
Accurate?

Control & software1

Capture Rate (Data from D&E recipe[1]
Accurate?

Configuration & options8

5 Wire[1]
Accurate?
Die to Die ” and Cell to Cell ” comparison capability[1]
Accurate?
Can use reflected --( BrigthField ) and scattered signal (GF = GreyField ) in parallel for detection[1]
Accurate?
Manufacturer
Applied Materials[1]
Accurate?
Model
UVision SP 200[1]
Accurate?
Category
Metrology & Inspection[2]
Accurate?
Comparison capability
Die to Die and Cell to Cell comparison capability[1]
Accurate?
Detection mode
Can use reflected brightfield and scattered signal (greyfield) in parallel for detection[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Phase3 Phase[1]
  • Configuration50/60 Hz[1]
  • Power3 Phase[1]
  • Frequency50/60 Hz[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What wafer size does the UVision SP 200 handle?

The UVision SP 200 is configured for 12-inch wafers.[1][2]

What kind of wafers can the UVision SP 200 inspect?

The UVision SP 200 is designed to inspect pattern wafers, and it can also inspect bare and unpatterned wafers.[1][2]

What comparison modes are supported?

The UVision SP 200 supports die-to-die comparison and cell-to-cell comparison.[1][2]

What signal types are used for detection?

The UVision SP 200 can use reflected brightfield and scattered greyfield signals in parallel for detection.[1][2]

Not publicly documented

The following facts about the UVision SP 200 Brightfield Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UVision SP 200 Brightfield Wafer are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the UVision SP 200 Brightfield Wafer are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the UVision SP 200 Brightfield Wafer are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the UVision SP 200 Brightfield Wafer are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the UVision SP 200 Brightfield Wafer is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
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Last updated Oct 8, 2026.

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