ASM
339 Eagle
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedA wire bonder forms electrical interconnections by placing a bond tool over a device pad or lead and creating a mechanical and electrical connection with wire.
A wire bonder typically uses a controlled bonding head, precision positioning stages, and process parameters that govern bond formation and wire placement.
Where it fits in the process flow
General reference — not yet source-verifiedThe ASM 339 Eagle belongs in the semiconductor assembly flow after die attach and before later package completion steps that depend on chip-to-package interconnects.
The ASM 339 Eagle supports package-level connection of the die to the surrounding circuit so the assembled device can move toward final test and integration.
Applications
The ASM 339 Eagle is used for packaging and bonding work in semiconductor manufacturing.[1]
What do the numbers mean?
Configuration & options4
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 339 Eagle are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 339 Eagle are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 339 Eagle are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 339 Eagle are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 339 Eagle are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 339 Eagle is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]Equipment inventory listing
- [3]ASM 339 Eagle Wire Bonder - SW Technology — swtechnology.com.sgswtechnology.com.sg
Last updated Oct 8, 2026.
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