ASM
AD 809
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASM AD 809 is a die bonder manufactured by ASM. The ASM AD 809 is categorized as Packaging & Bonding equipment. The ASM AD 809 handles 6-inch wafers.[1]
What it is
How it works
General reference — not yet source-verifiedA die bonder typically picks a die from a wafer or tray, applies a bonding material such as epoxy or solder, and places the die onto a package substrate.
Where it fits in the process flow
General reference — not yet source-verifiedIn the packaging workflow, die bonding follows wafer dicing and precedes wire bonding and molding.
Applications
General reference — not yet source-verifiedDie bonders are used to assemble semiconductor devices, including integrated circuits and discrete components, for a wide range of electronic applications.
What do the numbers mean?
Wafer handling1
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the AD 809 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the AD 809 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AD 809 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AD 809 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AD 809 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AD 809 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]Equipment inventory listing
Last updated Oct 7, 2026.
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