ASM
Eagle 60 AP
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
ASM Eagle 60 AP is a wire bonder used in semiconductor packaging. ASM Eagle 60 AP units are available with 240 V single phase power at 50/60 Hz.[1][2][3][4]
What it is
How it works
General reference — not yet source-verifiedWire bonding machines typically employ thermosonic or ultrasonic bonding techniques to attach wires. A bonding tool, either a capillary for ball bonding or a wedge for wedge bonding, feeds a wire and applies a combination of heat, pressure, and ultrasonic energy to create metallurgical bonds at both die and substrate pads. The bonder moves the tool between bond locations using precision servo-controlled stages.
What do the numbers mean?
Power & electrical5
Configuration & options5
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of bonding materials are used with die bonding machines?General reference — not yet source-verified
Common materials include silver-filled epoxy, solder paste, solder preforms, and adhesive films. The choice depends on the thermal and electrical requirements of the package.
How accurate is die placement?General reference — not yet source-verified
Placement accuracy is a key specification, with modern machines offering high repeatability within tight tolerances, but specific values vary by model.
Can the machine handle different die sizes?General reference — not yet source-verified
Machines of this class are typically configurable to handle a range of die sizes, from small individual die to larger power devices, but the range depends on the specific tooling.
How does the machine cope with wafer warpage or die position variations?General reference — not yet source-verified
Systems often include wafer mapping and adaptive alignment features to compensate for die position variations, ensuring accurate placement despite warpage or irregular spacing.
What is the typical throughput?General reference — not yet source-verified
Throughput depends on die size, placement accuracy requirements, and material handling speed, but these machines are designed for high-volume production. Actual cycle times vary by model and process conditions.
Not publicly documented
The following facts about the Eagle 60 AP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Eagle 60 AP are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Eagle 60 AP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Eagle 60 AP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Eagle 60 AP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Eagle 60 AP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Inventory photo
- [3]Equipment inventory listing
- [4]Inventory photo
Last updated Oct 3, 2026.
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