Axcelis
NV 8200
What it is
The Axcelis NV 8200 is an ion implantation system designed for 200 mm wafers. The system supports an energy range from 3 to 250 keV in a single configuration and up to 750 keV in a triple configuration. The NV 8200 provides a dose greater than 1E11 atoms per square centimeter. The beam current is less than 1 mA. The implanter is equipped with four process gas lines for BF2, PH3, AsH3, and Hydrogen, plus one line for Argon. Three ion sources are installed, each with a dual vaporizer.[2][1]
How it works
The Axcelis NV 8200 uses a 90° dipole magnet from Buckley Systems for mass analysis. The magnet is capable of analyzing ions from 0 to 75 atomic mass units in full charge. The target positioning system employs a parallel beam approach and electrostatic angle correction programmable over a tilt range of 0° to 60°. The end station includes flat/notch alignment with three cassette positions and a three-axis robotic pick-and-place system. Wafer clamping is accomplished with an electrostatic clamp. The system uses SPARC V software for control.[2]
Where it fits in the process flow
General reference — not yet source-verifiedIon implantation typically follows photolithographic patterning steps. After implantation, the wafer undergoes rapid thermal annealing to activate the dopants and repair crystal damage. The process is used to form doped regions such as source/drain extensions, well implants, and halo implants in CMOS devices.
Applications
General reference — not yet source-verifiedIon implanters are used to dope silicon wafers with precise concentrations and depths. Common dopants include boron, phosphorus, and arsenic. Implantation is also used for threshold voltage adjustment and for forming buried layers.
What do the numbers mean?
Vacuum & pumping4
Wafer handling6
Gas & chemistry5
Control & software2
Configuration & options21
- Target positioning/ scanning system:[2]
- Parallel beam[2]
- Electrostatic angle correction programmable[2]
- Tilt 0°-60°[2]
- End station:[2]
- Pick & Place system[2]
- Edwards STP 1003C for Source[2]
- Target positioning / scanning system
- Parallel beam; electrostatic angle correction programmable; tilt 0°-60°[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationGas lines:[2]
- Configuration4 process gas lines (BF2/PH3/AsH3/Hydrogen)[2]
- Configuration1 gas line (Argon)[2]
- Cryo compressorCTI Cryogenics 9600[2]
- ConfigurationTurbo pumps:[2]
- Process gas lines4 process gas lines (BF2/PH3/AsH3/Hydrogen)[2]
- Gas line1 gas line (Argon)[2]
- Turbo pumpsEdwards STP 1003C for Source; Pfeiffer HiPace 300 + Pfeiffer TPH 1201 P for Beam Line[2]
- Rough pumpsAdixen A 103 P for Source; Adixen A 103 P for Beam Line; Alcatel/Adixen ADS 602 P for End Station[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer size does the Axcelis NV 8200 handle?
What energy range is available on the NV 8200?
The NV 8200 supports an energy range from 3 to 250 keV in a single configuration, and up to 750 keV in a triple configuration.[2]
What dopant gases are supported?
The system supports BF2, PH3, AsH3, Hydrogen, and Argon process gases.[2]
What type of magnet is used for mass analysis?
A 90° dipole magnet from Buckley Systems is used, capable of analyzing up to 75 atomic mass units in full charge.[2]
What is the tilt range for wafer implantation?
The tilt range is programmable from 0° to 60°.[2]
Not publicly documented
The following facts about the NV 8200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NV 8200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the NV 8200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the NV 8200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NV 8200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the NV 8200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Equipment inventory listing
Last updated Oct 2, 2026.
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