Besi
Fico MMS X
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedTransfer molding machines in the Fico series use a plunger to transfer molten molding compound into a mold cavity. A preheated pellet of epoxy molding compound is placed in a transfer pot. The plunger forces the compound under pressure into the mold, where it encapsulates the semiconductor devices. The compound then cures inside the heated mold to form the final package body.
Applications
General reference — not yet source-verifiedThe Besi Fico MMS X is used for transfer molding of a variety of semiconductor package types. Common package families molded on such equipment include quad flat packages (QFPs), ball grid arrays (BGAs), and leaded packages. The process provides mechanical protection and environmental sealing for the encapsulated devices.
What do the numbers mean?
Configuration & options4
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What company manufactures the Besi Fico MMS X?
The Besi Fico MMS X is manufactured by Besi, formerly Datacon.[1][2]
What is the machine type of the Besi Fico MMS X?
The Besi Fico MMS X is a molding machine used in semiconductor packaging.[1]
In which process category is the Besi Fico MMS X used?
The Besi Fico MMS X is categorized under Packaging & Bonding.[2]
Not publicly documented
The following facts about the Fico MMS X are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Fico MMS X are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Fico MMS X are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Fico MMS X are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Fico MMS X are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Fico MMS X is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Fico MMS X — Besi | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Sep 23, 2026.
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