Branson
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The Branson IPC 3000 is a barrel plasma asher that generates a low-pressure, low-temperature gaseous plasma for ashing, etching, and polymer surface modification. The Branson IPC 3000 uses a 13.56 MHz RF generator for plasma power. The Branson IPC 3000 consists of two separate units, an RF Generator and a Reactor Center.[1][2]
The Branson IPC 3000 generates a low-pressure, low-temperature gaseous plasma. The system comprises a source of RF electrical power, means for coupling the RF power into the plasma treatment chambers, and a system to control the flow of reactant plasma gases. Two separate units are interconnected by gas hoses and electrical cables: the RF Generator and the Reactor Center.[5][4]
The Reactor Center contains the reactor chambers, gas controls, RF power matching controls, and a timer. Each chamber has a hinged access door through which samples are inserted or removed. The door is sealed with a bell jar gasket. The RF generator provides RF power that is dynamically regulated to maintain a constant level into a normal load or to limit power output if the load is removed.[5][4]
The system uses a quartz chamber reaction vessel. Process gas flow is controlled by up to three mass flow controllers. A mechanical pump provides the vacuum environment, and a Baratron gauge monitors pressure to ensure process repeatability. After upgrades, a new controller box with PC interface and touch-screen operation may be integrated.[3][2]
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| IPC 3000 O Asher | — | — | Designation used in operating manual; no technical distinction specified. | manualslib.com[5] |
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The Branson IPC 3000 can accommodate wafers from two inches up to eight inches in diameter.[1][2]
The Branson IPC 3000 has capability for up to three gas lines with mass flow controllers.[1][2]
The system operates at pressures from 0.1 to 5 torr.[4]
The Branson IPC 3000 is a barrel-type batch processor designed to handle multiple wafers in each run.[1][3]
The system is used for ashing (photoresist stripping), etching, and polymer surface modification, including plasma descum.[5][4][2]
The following facts about the IPC 3000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the IPC 3000 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the IPC 3000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the IPC 3000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the IPC 3000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the IPC 3000 are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Sep 29, 2026.