Bruker

Tespa

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BrukerTespa

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Power

320 kHz nominal; 270-370 kHz min/max^[2]

Optics

7-10 nm^[2]

What it is

The Tespa product family includes an unmounted probe format for use on standard AFMs. The family also includes a variant with reflective aluminum coating on the backside of the cantilever.^[2]^[4]^[3]^[5]

How it works

The Tespa family uses a rectangular silicon cantilever with a sharp tip. The coated versions use a reflective aluminum backside coating to improve laser signal for AFM optical detection.^[2]^[4]^[5]^[3]

The high-aspect-ratio Tespa variant uses focused ion beam milling to modify the tip geometry. The modified tip geometry supports imaging of tall or deep features.^[3]

Where it fits in the process flow

The high-aspect-ratio Tespa variant is intended for samples with tall or deep geometry, including semiconductor trench imaging. The standard Tespa probe is intended for tapping mode and other non-contact modes in air.^[3]^[2]^[5]^[4]

What do the numbers mean?

Power & electrical3

TESPA-V2 frequency: 320 kHz nominal; 270-370 kHz min/max^[2]
TESPA-HAR frequency: 320 kHz nominal; 230-410 kHz min/max^[3]
Frequency: 320 kHz^[2]

Optics & imaging3

TESPA-V2 tip radius: 7-10 nm^[2]
TESPA-HAR tip radius: 10-15 nm^[3]
Tip radius: 7 to 10 nm^[2]

Dimensions & facilities6

TESPA-V2 width: 40 µm nominal; 37-42 µm min/max^[2]
TESPA-V2 tip height: 12.5 µm nominal; 10-15 µm range^[2]
TESPA-HAR width: 40 µm nominal; 30-50 µm range^[3]
TESPA-HAR tip height: 10-15 µm^[3]
Width: 40 µm^[2]
Tip height: 12.5 µm^[2]

Configuration & options35

Make: Bruker^[1]
Model: Tespa^[1]
Product type: Prober^[1]
TESPA-V2 package quantity: Pack of 10^[2]
TESPA-V2 probe type: High quality etched silicon probes^[2]
TESPA-V2 application modes: TappingMode and other non-contact modes^[2]
TESPA-V2 mounting: Unmounted for use on standard AFMs^[2]
TESPA-V2 geometry: Rectangular^[2]
TESPA-V2 spring constant: 37 N/m nominal; 19-55 N/m min/max^[2]
TESPA-V2 length: 123 µm nominal; 120-125 µm min/max^[2]
TESPA-V2 cantilever thickness: 3.3 µm nominal; 2.8-3.8 µm range^[2]
TESPA-V2 cantilever material: Si^[2]
TESPA-V2 reflex coating: Reflective Aluminum^[2]
TESPA-V2 front angle: 25° nominal; 22.5-27.5° range^[2]
TESPA-V2 back angle: 17.5° nominal; 15-20° range^[2]
TESPA-V2 side angle: 20° nominal; 17.5-22.5° range^[2]
TESPA-HAR geometry: Rectangular^[3]
TESPA-HAR spring constant: 42 N/m nominal; 20-80 N/m min/max^[3]
TESPA-HAR length: 125 µm nominal; 110-140 µm range^[3]
TESPA-HAR application note: Ideal for TappingMode imaging on samples with tall/deep geometries, such as semiconductor trench imaging^[3]
TESPA-HAR tip angles: Front 5° ± 1°, back 5° ± 1°, side 5° ± 1°^[3]
TESPA-HAR cantilever thickness: 4 µm nominal; 3.25-4.75 µm range^[3]
TESPA-HAR back side coating: Reflective Aluminum^[3]
Type: AFM probe^[4]
Use mode: TappingMode and other non-contact modes^[2]
Probe material: etched silicon^[2]
Geometry: rectangular^[2]
Cantilever material: Si^[2]
Spring constant: 37 N/m^[2]
Length: 123 µm^[2]
Cantilever thickness: 3.3 µm^[2]
Reflex coating: Reflective aluminum^[2]
Front angle: 25°^[2]
Back angle: 17.5°^[2]
Side angle: 20°^[2]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

TESPA-V2 frequency320 kHz nominal; 270-370 kHz min/max^[2]
TESPA-HAR frequency320 kHz nominal; 230-410 kHz min/max^[3]
Frequency320 kHz^[2]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

Why is probing done before assembly?General reference — not yet source-verified

Probing allows devices to be evaluated before they are built into later packages or integrated assemblies, which helps identify electrical issues early.

What makes this class different from general measurement equipment?General reference — not yet source-verified

A test and probe system combines precision motion and direct contact formation with measurement electronics, making it suited to testing tiny on-sample features rather than disconnected parts.

Not publicly documented

The following facts about the Tespa are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Tespa are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Tespa are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Tespa are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Tespa are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Tespa is not on record.
Answerable by: an OEM datasheet or a fab qualification report