CHA
SEC 1000 RAP Vacuum
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
CHA SEC 1000 RAP Vacuum is a vacuum evaporation system. CHA SEC 1000 RAP Vacuum is used to deposit thin films of metals, alloys, and compounds on a variety of substrates. CHA SEC 1000 RAP Vacuum is categorized as deposition equipment.[1][2]
What it is
How it works
The baseplate, typically 20 inches in diameter, can accommodate up to 15 feedthroughs for instrumentation, control, and rotary motion.[1]
The system is often paired with a large bell jar and a planetary fixture, enabling it to hold multiple large wafers.[1]
An advanced crystal deposition monitor is included, and the system offers options for automatic or manual valve control.[1]
The bell jar is raised and lowered by a motorized hoist, and the average pump-down time is short, contributing to higher wafer throughput per hour.[1]
Where it fits in the process flow
General reference — not yet source-verifiedThe system is also employed for optical coating steps where precise thin-film stacks are required on components such as lenses and mirrors.
Applications
The SEC 1000 RAP is used for depositing thin films of metals, alloys, and compounds in semiconductor chip manufacturing, optical component coating, and materials research.[1]
What do the numbers mean?
Vacuum & pumping3
Wafer handling1
Optics & imaging1
- Applications
- Semiconductor chip manufacturing, optical component coating, and thin-film preparation in materials research[1]
Configuration & options3
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of pumps does the SEC 1000 RAP use?
The system uses a diffusion pump and a roughing pump.[1]
Does the system include an electron beam source?
Yes, it is equipped with an electron-beam power supply, control device, and an electron gun with a shutter.[1]
What is the typical baseplate size of the SEC 1000 RAP?
The baseplate is typically 20 inches in diameter and can be fitted with up to 15 feedthroughs.[1]
Is the SEC 1000 RAP capable of holding multiple wafers?
Yes, it is often paired with a large bell jar and a planetary fixture that can hold multiple large wafers.[1]
Not publicly documented
The following facts about the SEC 1000 RAP Vacuum are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SEC 1000 RAP Vacuum are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SEC 1000 RAP Vacuum are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SEC 1000 RAP Vacuum are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SEC 1000 RAP Vacuum are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SEC 1000 RAP Vacuum is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]his-tek.com — his-tek.comhis-tek.com
- [2]SEC 1000 RAP Vacuum — CHA | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [3]Inventory photo
Last updated Oct 8, 2026.
Compare with similar tools
View all →
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.