Datacon
2200
The Datacon 2200 apm Multi Chip Die Bonder is a die bonder developed for advanced packaging. The 2200 apm supports flip chip, die attach, or a combination of both connection technologies. The 2200 apm is based on the Datacon PPS 2200 platform that was introduced in 1995.[1]
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What it is
How it works
Where it fits in the process flow
The Datacon 2200 apm serves die attach, flip chip, hybrid and MCM assembly, optoelectronics, system in package, stacked die, and thin die applications.[1]
Applications
The Datacon 2200 apm is intended for advanced packaging work that uses flip chip, die attach, or both within one platform.[1]
The Datacon 2200 apm is used for hybrid and MCM assembly, optoelectronics, system in package, stacked die, and thin die work.[1]
- Die Attach
- Flip Chip
- Hybrid/MCM
- Optoelectronics
- System in Package (SiP)
- Stacked Die
- Thin Die
What do the numbers mean?
Wafer handling2
- Features & highlights
- Automatic Tool Changer System; Automatic Wafer Handling System; Flip Chip Unit; Needle Ejector System; Processing of Epoxy, Flux and Solder Paste; Software Features & Options; Tape Feeder[1]
Configuration & options9
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 2200 apm+ | — | — | — | web.archive.org[1] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 2200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the 2200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2200 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 2200 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
Last updated Oct 10, 2026.
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