Datacon
8800
Datacon 8800 FC Smart Line is a complete RFID chip attach equipment solution based on reel-to-reel production. Datacon 8800 FC Smart Line is designed for direct chip attach and indirect chip attach. Datacon 8800 FC Smart Line has core specifications including up to 10,000 UPH and 40 µm at 3 s.[1]
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What it is
The Datacon 8800 is an RFID chip attach equipment platform for direct chip attach and indirect chip attach production.[1]
The Datacon 8800 FC Smart Line is a reel-to-reel production line for RFID chip attach that combines flip-chip bonding, dispensing, inspection, and heated pressing in one equipment solution.[1]
How it works
The Datacon 8800 FC Smart Line uses a flip-chip bonder with dispensing and fluxing capability, die pick-and-place, and inspection capability.[1]
Where it fits in the process flow
The Datacon 8800 FC Smart Line is arranged as a complete reel-to-reel line in which the product is finished after spooling up, with optional testing and reject marking at the end of the line.[1]
The Datacon 8800 FC Smart Line integrates direct and indirect chip attach workflows and supports both strap and antenna-web attachment.[1]
Applications
The Datacon 8800 FC Smart Line is intended for RFID production that uses direct chip attach or indirect chip attach.[1]
The Datacon 8800 FC Smart Line supports NCP, ACP, and soldering processes including C4 and GBS gold bump soldering.[1]
The Datacon 8800 FC Smart Line is specified for high-volume RFID chip assembly with throughput up to 10,000 UPH and placement accuracy of 40 µm at 3 s.[1]
- RFID direct chip attach
- RFID indirect chip attach
Why won't it start?
Documented failure modes, common issues, and field considerations.
- The 8800 GT/8800 GTS 512 MB compatibility issue with older PCI Express 1.0a motherboards is unrelated to this equipment and was not included.
What do the numbers mean?
Wafer handling17
- Assembly systems
- Two independent assembly systems with two flip units picking dies from one wafer, two bond heads, two dipping units, and two substrate and upward looking camera systems[1]
- Assembly systems
- Two independent assembly systems with two flip units, two bond head, two dipping units, and two substrate and upward looking camera systems[1]
Optics & imaging1
Performance6
Dimensions & facilities5
Configuration & options27
- Functions
- Dispense and fluxing capability, flip chip pick & place, and inspection capability[1]
- Interconnection technologies
- FC soldering (C4, GBS-gold bump soldering) and adhesive FC bonding (NCP, ACP)[1]
- Chip attach application
- Chip attach of any WL-FOP process, supporting both face-down and face-up package designs[3]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Datacon 8800 FC QUANTUM advanced | — | — | Described as a new flip chip system with CRYSTAL concept, enhanced motion control, full process and yield control, proven 5 µm accuracy, and up to 10,000 UPH. | besi.com[4] |
| Datacon 8800 FC QUANTUM advX | — | — | Described as supporting die sizes from 0.3 to 40 mm with 4 µm placement accuracy and up to 10,000 UPH. | besi.com[2] |
| Datacon 8800 CHAMEO advanced | — | — | Described as a chip attach system for wafer-level fan-out packaging with face-down and face-up package designs, 300 mm / 340 mm fan-out wafer level packages, and up to 7,000 UPH. | besi.com[3] |
| Datacon 8800 FC Smart Line RFID | — | — | Complete reel to reel solution with integrated dispensing system, post-dispense inspection, dual-head bonding system, 25 slot SEMI standard wafer magazines, thermo-controlled heated press, spooler system, and wafer mapping according to SEMI standard with ALPS conversion licence. | web.archive.org[1] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of RFID chips can be handled by this class of equipment?General reference — not yet source-verified
Machines of this class can typically handle a range of RFID chips from small single-die packages to multi-die modules, provided the chips are supplied in a suitable format such as wafer film frame, gel pack, or tape-and-reel. The placement accuracy is sufficient for chips with pitches down to a few tens of micrometers.
What bonding methods are used in RFID chip attach machines?General reference — not yet source-verified
Common bonding methods include thermocompression bonding with anisotropic conductive adhesive (ACA), ultrasonic bonding, and adhesive cure using heat or UV. The choice depends on the substrate material (flexible PET, paper, or rigid PCB) and the required electrical performance.
What throughput rates are typical for RFID chip attach machines?General reference — not yet source-verified
Throughput is determined by the pick-and-place cycle time, substrate indexing speed, and curing time if inline bonding is used. Class-level machines are designed to balance speed and accuracy for high-volume production, but specific numbers vary widely by model and chip size.
Can these machines be converted to handle other die sizes or different package types?General reference — not yet source-verified
Yes, most machines of this class offer modular tooling (changeable collets, bond heads, and wafer ring adapters) to accommodate different chip sizes and forms. Some also support hybrid bonding where both RFID chips and other components (e.g., sensors) are mounted on the same substrate.
Not publicly documented
The following facts about the 8800 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 8800 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 8800 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 8800 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 8800 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 8800 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]besi.com — besi.combesi.com
- [3]besi.com — besi.combesi.com
- [4]besi.com — besi.combesi.com
Last updated Oct 10, 2026.