Electroglas
EG 4090
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The Electroglas EG 4090 is a wafer probing and test system.[1]
How it works
General reference — not yet source-verifiedA wafer prober positions a wafer under a probe card or probes and makes temporary electrical contact to individual sites so test signals can be applied and measurements can be collected.
Where it fits in the process flow
The EG 4090 is used in production environments that emphasize throughput for 200 mm wafer probing and large numbers of die per wafer.[2]
Applications
The EG 4090 is used for wafer probing in semiconductor manufacturing.[1]
What do the numbers mean?
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 4090u+ | — | — | Described as the fast probe version for high throughput of small die and 200 mm wafer production. | web.archive.org[2] |
Parts & consumables
Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.
- Electroglas EG 4090 Spare PartsIn Productionsource[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How does a wafer prober align the wafer?General reference — not yet source-verified
A wafer prober uses alignment marks on the wafer, typically crosses or other fiducials, along with an optical system (microscope and camera) to find those marks. Pattern recognition software computes the offset and corrects the wafer's position through precise motion of the chuck in X, Y, and theta.
Can a wafer prober handle different wafer sizes?General reference — not yet source-verified
While specific models are designed for certain wafer diameters, the class of wafer probers generally includes configurations that accommodate common wafer sizes used in semiconductor manufacturing. Adaptable chucks and handling mechanisms allow for changeover between sizes within a machine's design range.
What are common maintenance tasks for wafer probers?General reference — not yet source-verified
Common maintenance tasks include cleaning probe tips to remove debris or oxide buildup, checking and replacing probe cards, calibrating alignment optics, and lubricating moving parts. Regular calibration of the chuck's motion and alignment accuracy is also necessary to maintain test yield.
Not publicly documented
The following facts about the EG 4090 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EG 4090 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the EG 4090 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EG 4090 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the EG 4090 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly hosted manuals, SOPs, or datasheets for the EG 4090 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]web.archive.org — electroglas.com (Oct 28, 2021)web.archive.org
- [3]Equipment inventory listing
Last updated Oct 9, 2026.
