DB 2100 FC HS Flip Chip

The Esec DB 2100 FC HS is a flip chip bonder for semiconductor packaging and bonding operations. The machine is manufactured by Esec. The model designation is DB 2100 FC HS.^[1][2]

Flip-chip bonders pick singulated die from a wafer, wafer tape, or tray and present them to an alignment station. The alignment station uses vision systems to compare die and substrate features before bonding. After alignment, the bonder places the die onto the substrate and applies bonding energy to form the interconnection. Common bonding energy methods in this class include thermocompression, reflow, and thermosonic or ultrasonic processes.

The bond head carries the die and controls its orientation during placement. The substrate stage holds the package substrate or lead frame in position under the bond head. Precision motion axes position the die over the bond site, and bond-force control governs the force applied by the bond head during contact.

Flip-chip bonding is part of the assembly and packaging stage of semiconductor manufacturing, after wafer fabrication and wafer-level processing are complete. Upstream operations include wafer bumping, inspection, and singulation of the die. Downstream operations include flux cleaning, underfill dispensing, and package encapsulation or molding.

Solder bump, gold bump, and copper pillar interconnect systems can be processed by flip-chip bonders of this class. Flux may be applied before placement or supplied by the bump itself, depending on the process configuration.