EV Group
EV 501 Wafer
Plate 01EVG 501 Wafer Bonder (ID# 4726)
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Wafer size
Capable of thermo compression, fusion or anodic wafer bonding
Vacuum
Turbo Pump[1]
Performance
± 1,5 %[1]
What it is
How it works
The EV 501 Wafer includes a bottom side heater with a maximum temperature of 550°C in 1°C steps. The EV 501 Wafer also includes a high-voltage power supply for anodic bonding, and additional tooling may be required for that mode.[1][2]
The EV 501 Wafer includes a turbo pump and a roughing pump. The EV 501 Wafer also includes computer and software, an electronics rack, and an LCD monitor in the configured tool set.[1][2]
Where it fits in the process flow
General reference — not yet source-verifiedWafer bonding sits in back-end or packaging-oriented process flows where finished or partially finished wafers are joined to another wafer or to a bonding substrate. The process follows earlier surface preparation and patterning steps and precedes downstream singulation, packaging, or integration steps.
Applications
What do the numbers mean?
Power & electrical2
Vacuum & pumping4
Wafer handling6
- Bond chamber for small pieces up to 150 mm wafers (with correct tooling)[1]
Performance1
Control & software2
- Computer & Software[1]
Configuration & options9
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the EV 501 Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EV 501 Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the EV 501 Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the EV 501 Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EV 501 Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the EV 501 Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]EV 501 Wafer — EV Group | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [3]EV Group EV 501 Wafer family | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 11, 2026.
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