EV Group
The EV Group Gemini Automated Production Wafer Bonder is a fully automated wafer bonding system. The EV Group Gemini Automated Production Wafer Bonder handles wafers up to 8"/200mm. The EV Group Gemini Automated Production Wafer Bonder includes face-to-face alignment.[1][2]

Plate 01EVG Gemini Fully Automated Production Bonding System
Wafer size
200mm
Performance
with Face to Face Alignment[1]
Gas delivery
1 purge gas line for process gas[1]
A production wafer bonder in this class typically receives prepared wafers after front end patterning or after intermediate integration steps, then aligns and bonds them before later thinning, singulation, or package completion steps. The machine supports automated recipe control for production flow management.
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The following facts about the Gemini Automated Production Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Gemini Automated Production Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Gemini Automated Production Wafer are on record.
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The control-system platform and OS era of the Gemini Automated Production Wafer are not on record.
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No publicly documented failure modes or field errata for the Gemini Automated Production Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Gemini Automated Production Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 4, 2026.
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