Finetech

Fineplacer 96

Packaging & Bonding Wafer Ring Holder,Finetech Fineplacer 96 family

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Fineplacer 96 — Inventory photo — Fig. 01Fineplacer 96Inventory photo^[1]

Plate 01Virtual Product Inspection at Salvex - Finetech Fineplacer-96 with Accessories & Upgraded Options
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Wafer size

Wafer Ring Holder,

Performance

0.5 µm^[3]

What it is

The Finetech Fineplacer 96 is a die bonder in the packaging and bonding equipment class.^[1]^[2]^[4]

The Fineplacer 96 family includes optional modules for flip chip, epoxy dispenser, pick and place, UV curing, heat plate, wafer ring holder, accessories, and an isolated table.^[1]^[2]^[4]

How it works

The Fineplacer 96 can be configured with flip chip, epoxy dispensing, pick and place, UV curing, heat plate, wafer ring holder, and isolated table functions.^[1]^[2]^[4]

Where it fits in the process flow

General reference — not yet source-verified

The Fineplacer 96 sits in semiconductor packaging and bonding flow after die preparation and before final package completion.

The machine supports attachment and interconnect steps that join bare dies to package substrates or related carriers.

Applications

The Fineplacer 96 is used for die attach and flip chip work.^[3]

The Fineplacer 96 can also be used with SMD, UV, and wafer ring release module bonding configurations.^[3]

What do the numbers mean?

Wafer handling4

Wafer size: Wafer Ring Holder,^[2]
Optional modules: Flip Chip Module; Epoxy Dispenser Module; Pick & Place Module; UV Curing System; Heat Plate; Wafer Ring Holder; Accessories; Isolated Table^[1]
Available options: Die Attach; SMD; FLIP CHIP; UV Wafer Ring Release Module^[3]2 sources
Substrate size: 50 mm × 50 mm (thermal compression); 180 mm × 108 mm (pick-n-place only)^[3]2 sources

Performance1

Bonding accuracy: 0.5 µm^[3]2 sources

Configuration & options18

Add On Option:^[1]; Flip Chip Module^[1]; Epoxy Dispenser Module^[1]; Pick & Place Module^[1]; UV Curing System^[1]; Heat Plate^[1]; Accessories, and^[1]; Isolated Table^[1]
Tool type: Die bonder^[2]
Category: Packaging & Bonding^[2]
Description: Manual FlipChip Bonder^[3]
Max. die/package size: 16 mm (pick-n-place only)^[3]2 sources
Min. die/package size: 0.5 mm^[3]2 sources
Bonding environment: Nitrogen / formic acid^[3]2 sources
Bonding mechanism: Thermo-compression; reflow; thermo-sonic^[3]2 sources
Thermo-compression bonding force: 0.1 ~ 200 N^[3]2 sources
Reflow temperature: RT ~ 400 °C^[3]2 sources
Reflow heating rate: 20 °C/s^[3]2 sources

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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What kinds of joining methods can this class of machine support?General reference — not yet source-verified

Machines of this class may support adhesive bonding, thermocompression, heat-assisted joining, ultrasonic bonding, or similar attachment methods depending on the process.

Why is precision important in this class of equipment?General reference — not yet source-verified

Small components and fine interconnect features require accurate placement, stable holding, and controlled bonding so the assembly functions correctly.

Not publicly documented

The following facts about the Fineplacer 96 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Fineplacer 96 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Fineplacer 96 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Fineplacer 96 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Fineplacer 96 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Fineplacer 96 is not on record.
Answerable by: an OEM datasheet or a fab qualification report