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Gaertner

L116SF

Gaertner L116SF family
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The Gaertner L116SF is an ellipsometer. The Gaertner L116SF was used to measure film thickness. The Gaertner L116SF was equipped with a He-Ne laser at 632.8 nm and set at an incident angle of 70°.[1]

GaertnerL116SF
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What it is

The Gaertner L116SF is a vapor-phase deposition system used for surface modification of silicon and polydimethylsiloxane surfaces.[1]

How it works

The Gaertner L116SF uses a vapor-phase deposition process to place fluorosilane films onto silicon and PDMS surfaces.[1]

The deposition system accommodates silicon wafers and PDMS or arrays of silicon and PDMS chips with microfabricated nanochannels.[1]

Where it fits in the process flow

The Gaertner L116SF sits in a surface-functionalization step after substrate cleaning or plasma treatment and before use of the modified silicon or PDMS in microfluidic or nanochannel structures.[1]

The process uses pretreated silicon wafers and PDMS surfaces as substrates for silane attachment.[1]

Applications

The Gaertner L116SF is used for depositing fluorosilane films on silicon and PDMS surfaces to control hydrophobicity and reduce undesired protein adsorption or cell interactions.[1]

The equipment is suitable for micro- and nanofluidic devices that use silicon-based materials or PDMS, including structures with nanochannels.[1]

  • film thickness measurement

What do the numbers mean?

Optics & imaging1

laser
He-Ne laser, 632.8 nm[1]
Accurate?

Configuration & options3

instrument type
ellipsometer[1]
Accurate?
use
thickness measurement of films[1]
Accurate?
incident angle
70°[1]
Accurate?
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What materials does the Gaertner L116SF process?

The Gaertner L116SF processes silicon and PDMS surfaces.[1]

What kind of films are deposited with the Gaertner L116SF?

The Gaertner L116SF deposits fluorosilane films.[1]

What is the purpose of the fluorosilane coating step?

The fluorosilane coating step is used to control hydrophobicity and to reduce or prevent undesired protein adsorption or cell interactions.[1]

What kinds of substrates can the system accommodate?

The system can accommodate silicon wafers and PDMS or arrays of silicon and PDMS chips with microfabricated nanochannels.[1]

Not publicly documented

The following facts about the L116SF are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the L116SF are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the L116SF are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the L116SF are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the L116SF are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the L116SF is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]smif.pratt.duke.edu — smif.pratt.duke.edusmif.pratt.duke.edu
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Last updated Oct 9, 2026.

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