Hesse & Knipps

Heavy wire bonders such as the BJ 820 use ultrasonic energy to weld thick aluminum or copper wire to bond pads and substrate metallization.
Bonding parameters such as ultrasonic power, time, and force are programmable and can be stored in parameter libraries.
The BJ 820 is used in semiconductor back-end assembly after die attach and before encapsulation.
Typical packages include discrete power packages, hybrid modules, and large-area power substrates that require high-current carrying capability.
Documented failure modes, common issues, and field considerations.
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The BJ 820 is equipped with a 45-degree bond head.[3]
The following facts about the BJ 820 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the BJ 820 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the BJ 820 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the BJ 820 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the BJ 820 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the BJ 820 are on record.
Answerable by: an OEM parts catalog or a service engineer
Last updated Oct 3, 2026.
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