Ismeca
The Ismeca NY32 is a turret test platform for semiconductor test, inspection, and packaging. The Ismeca NY32 uses a 32-position turret platform. The Ismeca NY32 is suited for RF devices, small power management ICs, solid state lighting devices, and other ICs.[1]

The Ismeca NY32 is a 32-position turret platform for semiconductor test, inspection, and packaging.[1]
The Ismeca NY32 is suited to automated post-fabrication handling of packaged devices, bare die, and bumped die.[1]
The Ismeca NY32 is suited for RF devices, small power management ICs, solid state lighting devices, and other ICs.[1]
The Ismeca NY32 handles device types including discrete, power discrete, DFN/QFN, SOIC, LED, BGA, MEMS, WLCSP, bare die, and bumped die.[1]
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The NY32 is used for semiconductor test, inspection, and packaging.[1]
The NY32 includes full vision inspection, 3D topographic inspection, micro-crack detection, and infrared inspection.[1]
The NY32 supports output tube output and tape and reel output.[1]
The NY32 handles package sizes from 0.3 x 0.6 mm to 17 x 17 mm.[1]
The following facts about the NY32 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NY32 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the NY32 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the NY32 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NY32 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the NY32 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 9, 2026.