AIT XUV Darkfield

The KLA AIT XUV is a darkfield defect inspection system used for semiconductor wafer inspection. The system detects surface defects such as particles, scratches, and other anomalies on wafers. The KLA AIT XUV handles 12-inch wafers. The system is configured with SECS/GEM CIM, a FOUPS factory system, and a robot pillar handler system. The system operates with software version 6.3.24.3.^[3][1][2]

Darkfield inspection systems operate by directing a laser beam at a shallow angle onto the wafer surface. Defects on the surface scatter light, which is collected by optics positioned to capture only scattered light, while the specular reflection is excluded. The collected scattered light is then analyzed to map defect locations.^[1]

In a semiconductor fabrication facility, darkfield defect inspection tools like the AIT XUV are typically used for in-line monitoring after key process steps such as deposition, etching, and chemical mechanical polishing. The system helps detect contamination and process-induced defects before subsequent lithography or processing steps.^[1]

The KLA AIT XUV is used for darkfield defect inspection of semiconductor wafers. The system is applied to detect surface defects including particles, scratches, and other anomalies that scatter light. The tool supports inspection of 12-inch wafers and is configured for automated handling with FOUPS and a robot handler system, making it suitable for high-volume manufacturing environments.^[3][1][2]