Kurt Lesker
Nano36
The Kurt J Lesker Nano36 Thermal Deposition System is a thermal deposition tool. The Kurt J Lesker Nano36 Thermal Deposition System enables deposition of metals onto substrates up to 150 mm in diameter. The Kurt J Lesker Nano36 Thermal Deposition System has two crystal sensors with controller-based deposition rate and film thickness control.[1][2]
Where it fits in the process flow
The Nano36 is a deposition tool, so it sits within the materials-growth portion of a micro- or nanofabrication process flow rather than in lithography, etching, or metrology steps. The cleanroom nanofabrication facility at the University of Texas groups this system among its thin-film deposition capabilities. The facility's deposition toolkit includes electron-beam evaporation, sputtering, thermal evaporation, atomic layer deposition, and chemical vapor deposition, with thermal evaporation being the role filled by the Nano36.[4][1]
Applications
The primary application of the Nano36 is the deposition of metal thin films for device fabrication and materials research. At the University of Illinois facility, the system is configured for evaporation of Au, Ag, Cu, and Cr films. Because the tungsten boat and rod sources have limited capacity, the thickness limit is 200 nm per boat for Au, Ag, and Cu, and 40 nm per rod for Cr.[5]
The Nano36 supports deposition onto substrates up to 150 mm in diameter at the University of Texas facility. At the University of Illinois facility, the large wafer holder has an 8-inch diameter, and the deposition thickness variation from the center to the edge of the holder is about 10%. The University of Texas system is also specified for film uniformity of <8%.[1][5]
- Thin film fabrication
What do the numbers mean?
Power & electrical1
- Source characteristics
- DC power supply rated up to 12 V or 400 A; maximum applied power 2 kW[1]
Vacuum & pumping1
Wafer handling3
Performance2
- Thickness monitoring
- two crystal sensors with controller-based deposition rate and film thickness control[1]
Control & software1
Configuration & options8
- Deposition sources
- two thermal sources for co-deposition and four sources for sequential deposition[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the Nano36 used for?
The Nano36 is used to evaporate a metal film under high vacuum while measuring the thickness in situ with a thickness monitor. At the University of Illinois facility it is configured for Au, Ag, Cu and Cr evaporation.[5]
How many materials can be loaded in one batch?
Up to three different materials can be loaded in one batch at the University of Illinois facility. At the University of Texas facility, the system provides two thermal sources for co-deposition and four sources for sequential deposition.[5][1]
What is the maximum substrate size?
At the University of Texas facility, the Nano36 deposits onto substrates up to 150 mm in diameter. At the University of Illinois facility, the large wafer holder has a diameter of 8 inches.[1][5]
Is the deposition process automated?
The Kurt J. Lesker Nano36 at the University of Texas is controlled by KJL eKLipse software with a graphical recipe builder. The University of Illinois system has a programmable logic controller with a touch-screen interface and an auto operation mode.[1][5]
How is film thickness controlled?
The University of Illinois system uses an FTC-2800 film thickness controller. The University of Texas system uses two crystal sensors with controller-based deposition rate and film thickness control.[5][1]
What is the base pressure and film uniformity of the system?
At the University of Texas facility, the system has a base pressure of 5.0 × 10⁻⁶ Torr and film uniformity of less than 8%. At the University of Illinois facility, the deposition thickness variation is about 10% from the center to the edge of the 8-inch holder.[1][5]
Not publicly documented
The following facts about the Nano36 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Nano36 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Nano36 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Nano36 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Nano36 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Nano36 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]tmi.utexas.edu — tmi.utexas.edutmi.utexas.edu
- [2]Kurt J Lesker Nano36 Thermal Deposition System — tmi.utexas.edutmi.utexas.edu
- [3]tmi.utexas.edu — tmi.utexas.edutmi.utexas.edu
- [4]Cleanroom Nanofabrication Facility — tmi.utexas.edutmi.utexas.edu
- [5]Kurt J. Lesker Nano36 Thermal Evaporator System | Materials Research Laboratory | Illinois — mrl.illinois.edumrl.illinois.edu
- [6]Instrumentation — tmi.utexas.edutmi.utexas.edu
Last updated Sep 9, 2026.
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