LPKF
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The system uses a galvo-scanner to direct the laser beam across the substrate. Larger panels are processed by seamlessly stitching together scan fields, a technique called stitching. The machine includes a high-speed vision system for fiducial recognition and substrate alignment. A built-in power meter measures the laser output at the focal plane for process tracking. The LPKF CircuitPro PL software controls the process and provides a library of material parameters. For copper removal on laminated substrates, the ProtoLaser U4 utilizes a proprietary hatch-and-delamination ablation technique that minimizes the heat-affected zone.[3][1][2]
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The LPKF ProtoLaser U4 uses a UV laser source with a wavelength of 355 nm.[3][1]
The maximum working area is 229 mm × 305 mm × 10 mm, achieved by stitching scan fields.[3][1]
No, the system performs direct laser etching without any chemicals or resists.[2]
The following facts about the U 4 Proto are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the U 4 Proto are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the U 4 Proto are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the U 4 Proto are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the U 4 Proto are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the U 4 Proto is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 2, 2026.