Mattson
8800
The Mattson 8800 is a third-generation rapid thermal processing (RTP) tool. The Mattson 8800 was developed specifically for 0.25-micron process requirements and is a 200 mm single-wafer tool. The Mattson 8800 won Semiconductor International's Editor's Choice Best Product Award in 1997.[1]
What it is
The Mattson 8800 is a thermal processing tool in the rapid thermal processing class. The Mattson 8800 is a third-generation RTP tool developed for 0.25-micron process requirements. The Mattson 8800 is a 200 mm single-wafer RTP tool.[1][2][3]
How it works
The Mattson 8800 includes a ceramic shield option for backside emissivity independence and better wafer-to-wafer repeatability. The Mattson 8800 also includes a nitrogen curtain for minimum pre-purge time, a high process purge gas flow configuration for fast chamber purging, an ez-DTC feature for improved control, a high temperature end effector, a double O-ring seal system, swivel cassettes with independent swivels, and a standard slip-free ring package.[1][2]
Where it fits in the process flow
General reference — not yet source-verifiedThe Mattson 8800 sits in the thermal budget portion of the process flow. The Mattson 8800 supports short thermal steps that are used after wafer patterning or film deposition and before later integration steps.
Applications
The Mattson 8800 is used for TiSi2/TiN and CoSi2 processing. The Mattson 8800 is used for BPSG flow and densification, gate oxide anneal and nitridation in NO, N2O, and NH3, low temperature copper anneal, PZT anneals, and high-k dielectric anneal in N2O.[1][2]
- TiSi2/TiN
- CoSi2
- BPSG flow/densification
- Gate oxide anneal and nitridation (NO, N2O, NH3)
- Low temperature copper anneal
- PZT anneals
- High k dielectric anneal in N2O
What do the numbers mean?
Wafer handling5
- Ceramic Shield option
- Backside emissivity independence and better wafer-to-wafer repeatability[1]
Gas & chemistry1
Performance5
- Standard slip-free ring package
- High temperature slip-free processing and improved uniformity[1]
Configuration & options8
Vintage & configurations
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- High process purge gas flowFast chamber purging for high-throughput configuration[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 8800 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the 8800 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 8800 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 8800 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No publicly documented compatible parts, consumables, or accessories for the 8800 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 8800 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]8800 — Mattson | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [3]Mattson 8800 family | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 10, 2026.
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