Waferpedia

Micromanipulator

P 300 J Wafer

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

MicromanipulatorP 300 J Wafer
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Power

85 to 265 VAC, 47-63 Hz, 2.4 Amps typical[1]

Vacuum

25 in-Hg[1]

What it is

The Micromanipulator P 300 J is a manual analytical probe station designed for 300 mm wafers. The system is built for low-current, sub-micron positioning applications. The station includes a single-point ground, an integrated dry/dark enclosure, and support for thermal chucks.[1][2]

How it works

The P 300 J uses motorized controls with a joystick and MicroTouch interface to drive the stage, platen (Z), theta, and microscope X-Y and Z drives. The stage and platen have a positioning resolution of 0.1 microns. The stage travel range is 300 x 300 x 50 mm with 15 degrees of theta rotation. The microscope drive range is 100 x 100 mm (X-Y) and 200 mm (Z). The station features a single-point ground and an adjustable microscope lift delay to prevent probe damage. The system is also plumbed and wired to accept a thermal chuck with a temperature range of -55 to 300 °C.[1][2]

What do the numbers mean?

Power & electrical1

Controller power input
85 to 265 VAC, 47-63 Hz, 2.4 Amps typical[1]
Accurate?

Vacuum & pumping1

Vacuum requirement
25 in-Hg[1]
Accurate?

Wafer handling1

Wafer size
300 mm[1]
Accurate?

Optics & imaging1

Resolution
0.1 micron (stage, platen, microscope drive)[1]
Accurate?

Control & software2

RMC-7 controller dimensions
17.8 x 19.7 x 5.5 inches (45.2 x 50 x 13.9 cm)[1]
Accurate?
RMC-7 controller weight
24 lbs (11 kg)[1]
Accurate?

Dimensions & facilities2

Station dimensions (W x D x H)
33 x 40 x 33 inches (84 x 102 x 84 cm)[1]
Accurate?
Station weight
480 lbs (218 kg)[1]
Accurate?

Configuration & options4

Stage range
300 x 300 x 50 mm, theta 15 degrees[1]
Accurate?
Microscope drive range
100 x 100 mm (X-Y), 200 mm (Z)[1]
Accurate?
Temperature ranges (configurable)
Ambient to 300°C, 0°C to 300°C, -55°C to 300°C[2]
Accurate?
Platen material
Magnetic stainless steel[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Vacuum requirement25 in-Hg[1]
  • Controller power input85 to 265 VAC, 47-63 Hz, 2.4 Amps typical[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

Why test at the wafer level?General reference — not yet source-verified

Wafer-level testing allows devices and process structures to be evaluated early, which helps identify functional issues and monitor fabrication quality before later manufacturing steps.

What kinds of devices are measured with this class of equipment?General reference — not yet source-verified

Such systems are used for semiconductor devices and test structures that expose contact pads or probing sites on the wafer surface.

Not publicly documented

The following facts about the P 300 J Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the P 300 J Wafer are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the P 300 J Wafer are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the P 300 J Wafer are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the P 300 J Wafer are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the P 300 J Wafer is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]micromanipulator.com — micromanipulator.commicromanipulator.com
  2. [2]mercia-semiconductor.com — mercia-semiconductor.commercia-semiconductor.com
  3. [3]Equipment inventory listing
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Last updated Oct 6, 2026.

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