MRSI

705

Packaging & Bonding MRSI 705 family

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705 — Inventory photo — Fig. 01705Inventory photo^[1]

What it is

General reference — not yet source-verified

The MRSI 705 is a die bonder used in semiconductor packaging and bonding.

How it works

The MRSI 705 uses a single head and a gripper type handling approach, and the machine includes four stage ramp-up heating.^[1]^[2]^[3]^[4]^[8]

Where it fits in the process flow

The MRSI 705 is configured for magazine to magazine handling, manual loading, and Gelpak holder use, which places it in a packaging flow that moves parts from input handling into attach operations.^[1]^[2]^[3]^[4]^[8]

Applications

The MRSI 705 is suited to packaging and bonding work that benefits from magazine based handling, heating control, and high bondforce operation.^[1]^[2]^[3]^[4]^[8]

What do the numbers mean?

Configuration & options21

Magazine to Magazine^[1]; 4 Stage Ramp-up Heating^[1]; Manual Loading Gelpak Holder^[1]; Single Head^[1]; Gripper Type^[1]; High Bondforce Capable^[1]
Type: Die Bonder^[1]
Material Handling: Magazine to Magazine^[1]
Heating Stages: 4 Stage Ramp-up Heating^[1]
Holder Type: Manual Loading Gelpak Holder^[1]
Head Configuration: Single Head^[1]
Pick-Up Type: Gripper Type^[1]
Bondforce Capability: High Bondforce Capable^[1]
Vintage: 2014^[1]
Equipment type: Die bonder^[1]
Heating: 4 stage ramp-up heating^[1]
Loading: Manual loading^[1]
Holder: Gelpak holder^[1]
Bond type: Gripper type^[1]
Bondforce: High bondforce capable^[1]
Vintage: 2014 vintage^[1]

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What replaced it?

siblingMRSI M1— The MRSI product navigation lists MRSI-M1 and MRSI-705 as related models within the same product family.source^[6]
siblingMRSI M5— Listed in the same product navigation as the M5.source^[7]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

Does the MRSI 705 use manual loading?

The MRSI 705 uses manual loading.^[1]^[2]^[3]^[4]^[8]

Not publicly documented

The following facts about the 705 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 705 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 705 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 705 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 705 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 705 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (10)Every fact above is drawn from these public sources

[1]Inventory photo
[2]Inventory photo
[3]Inventory photo
[4]Inventory photo
[5]Inventory photo
[6]web.archive.orgweb.archive.org
[7]web.archive.orgweb.archive.org
[8]Equipment inventory listing
[9]Equipment inventory listing
[10]MRSI Systems受邀出席光收发器和硅基光电子论坛 — mrsisystems.com (Sep 15, 2021)web.archive.org