MRSI
HVM3
Produced
2018–
Vacuum
10 g to 5 kg per placement[4]
Performance
≤ 1 micron[4]
Gas delivery
Nitrogen, argon, N2-H2, or Ar-H2[4]
Optics
0.0045°[4]
What it is
Die bonders are precision assembly machines that pick semiconductor dice or other small components from a supply medium and place them onto a substrate or package with high positional accuracy. The MRSI HVM3 is a high-speed, ultra-precision die bonder designed for high-volume manufacturing in photonics and advanced microelectronics packaging. The MRSI HVM3 is part of the MRSI-M3 family of platforms and delivers placement accuracy of less than three micrometers. The system entered volume production in early 2018, driven by customer adoption in applications such as chip-on-submount, chip-on-carrier, and chip-on-baseplate assembly.[2][5]
How it works
The MRSI HVM3 uses a dual-head, dual-stage architecture with an integrated on-the-fly tool changer to achieve high throughput and zero-time tool change between different dice. The system incorporates multi-level parallel processing optimizations to maximize cycle time efficiency. An ultrafast eutectic stage is available for eutectic die bonding processes. The placement accuracy is maintained below three micrometers through the use of precision motion stages and vision alignment.[5]
What can it run?
Process applications and technology nodes documented for this tool.
- Microwave modules
- Optical modules
- Epoxy die bonding
- Eutectic die bonding
- Microwave and RF devices
- MEMS
- Photonic / optical components
- High-power semiconductor packaging
What do the numbers mean?
Vacuum & pumping3
Wafer handling1
Gas & chemistry1
Optics & imaging8
Performance5
Control & software1
Dimensions & facilities1
Configuration & options16
- Pickup nozzles
- 13 in standard nozzle changer; multiple changers optional; can also carry epoxy dispensing heads[4]
- Waffle packs
- Up to 72 2 x 2 in waffle packs (50.8 x 50.8 mm) or Gel-Paks™ or 4 x 4 in (101.6 x 101.6 mm)[4]
- Dispense needle cleaning
- Automated programmable cleaning between pattern dispense intervals[4]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| MRSI-HVM3 | — | 2019 | The sources state that from 2019-10-01 shipment, the product name changed from MRSI-HVM3 to MRSI-H. | web.archive.org[1] |
| MRSI-HVM3P | — | 2018 | Expanded the MRSI-HVM3 family with configurations for AOC, gold-box packaging, and other applications in addition to chip-on-carrier; equipped with inline conveyor for single fixture or multiple cassette inputs. | mycronic.com[5] |
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- ASM AD 838 L— Same function class: Packaging & Bonding, UnknownCompare in depthsource[6]
- Finetech Lambda— Same function class: Packaging & Bonding, nullCompare in depthsource[7]
- Esec DB 2100 HS— Same function class: Packaging & Bonding, nullCompare in depthsource[8]
- ASM LinDA— Same function class: Packaging & Bonding, nullCompare in depthsource[9]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What die bonding processes does the MRSI-HVM3 support?
The MRSI-HVM3 supports eutectic die bonding, epoxy stamping, UV epoxy dispensing, and in-situ UV curing.[5]
What assembly types is the MRSI-HVM3 designed for?
The MRSI-HVM3 is designed for chip-on-submount, chip-on-carrier, and chip-on-baseplate assembly, and with the HVM3P variant also for active optical cable assembly and gold-box packaging.[2][5]
Does the MRSI-HVM3 have a dual-head configuration?
Yes, the MRSI-HVM3 uses a dual-head, dual-stage architecture with an integrated on-the-fly tool changer.[5]
Not publicly documented
The following facts about the HVM3 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the HVM3 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the HVM3 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the HVM3 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the HVM3 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the HVM3 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (9)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]mycronic.com — mycronic.commycronic.com
- [3]web.archive.org — web.archive.orgweb.archive.org
- [4]web.archive.org — web.archive.orgweb.archive.org
- [5]mycronic.com — mycronic.commycronic.com
- [6]Equipment inventory listing
- [7]finetechusa.comfinetechusa.com
- [8]Equipment inventory listing
- [9]waferpedia.comwaferpedia.com
Last updated Sep 24, 2026.
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