Nordson
4000 Series Ball Sheer
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Nordson 4000 Series Ball Sheer is a bond tester. The Nordson 4000 Series Ball Sheer is used for wire pull, ball shear, and die shear testing. The Nordson 4000 Series Ball Sheer is manually operated.[1][2]
What it is
The Nordson / Dage 4000 Series Ball Sheer is a bond tester used for wire pull, ball shear, and die shear testing in semiconductor and microelectronics assembly.[2]
The system is designed for manual operation and supports a range of test methods including wire pull test, ball shear test, die shear test, stud die pull test, and tweezer peel pull test.[2]
The Nordson / Dage 4000 Series Ball Sheer is a bond tester.[3][1]
How it works
The Dage Stellar 4000 features an XY stage with 100mm x 100mm of travel, along with a maximum shear force of 100Kg and pull force of 10Kg.[2]
Quick change test cartridges enable a rapid change in test methods, from wire pull to shear test.[2]
The system uses patented technology for frictionless bond or die shear and features the Paragon Lite software interface.[2]
Where it fits in the process flow
Applications
The Dage Stellar 4000 supports test methods including wire pull test, ball shear test, die shear test, stud die pull test, and tweezer peel pull test.[2]
Industry segments include semiconductor, automotive, aerospace, military, telecommunications, medical electronics, fibre optics, photonic assembly, microwave electronics, microelectronics, power semiconductor assembly, semiconductor back-end assembly, PCB assembly industries, universities, and medical devices.[2]
What do the numbers mean?
Control & software1
Configuration & options6
- Test methods
- wire pull test, ball shear test, die shear test, stud die pull test, tweezer peel pull test[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How does a ball shear tester perform the test?General reference — not yet source-verified
The tester uses a precision shear tool applied to the side of a solder ball at a controlled height and speed. The system measures the force required to shear the ball off, along with the force-displacement profile.
What package types are typically tested with ball shear?General reference — not yet source-verified
Ball shear testing is commonly used on ball grid array (BGA) packages, chip-scale packages (CSP), flip-chip interconnects, and other devices where solder balls form the primary electrical and mechanical connection.
What failure modes can ball shear testing identify?General reference — not yet source-verified
Ball shear testing can reveal failure modes such as brittle fracture (intermetallic compound failure), ductile fracture (solder bulk failure), pad lifting, or substrate cracking, helping to diagnose process issues.
Not publicly documented
The following facts about the 4000 Series Ball Sheer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4000 Series Ball Sheer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 4000 Series Ball Sheer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 4000 Series Ball Sheer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 4000 Series Ball Sheer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 4000 Series Ball Sheer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]Bond Tester | Wire Bond Pull Tester | Bond & Die Shear Test — inseto.cominseto.com
- [3]Inventory photo
Last updated Oct 7, 2026.
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