Onto Innovation

NSX 105 Automated Wafer, Die & Bump

Metrology & Inspection Onto Innovation NSX 105 family

Research Quality: 50% complete

The Onto Innovation NSX 105 is an automated inspection system for wafers, dies, and bumps. The NSX 105 supports wafer sizes from 4 to 8 inches and is configured as an automatic defect inspection system.^[1]^[2]

NSX 105 Automated Wafer, Die & Bump — Inventory photo — Fig. 01NSX 105 Automated Wafer, Die & BumpInventory photo^[3]

Power

Single phase + GND^[4]

Optics

1, 2, 5, 20x^[1]

What it is

The Onto Innovation NSX 105 is an automated wafer, die, and bump inspection system.^[3]^[4]^[2]^[1]

How it works

General reference — not yet source-verified

Automated inspection systems in this class typically illuminate the target, capture images, and compare observed patterns against expected features to locate defects or anomalies.

Applications

The NSX 105 is used for automated defect inspection on semiconductor wafers, dies, and bumps.^[2]^[1]^[3]

What do the numbers mean?

Power & electrical12

Single phase + GND^[4]; 200-240 vac, 50/60 Hz^[4]
Full load: 6 amps^[4]
Largest load: 1.5 amps^[4]
Main Breaker: 20 Amps/10,000 AIC^[2]
Power Supply: 200-240 VAC, 50/60 Hz^[2]
Full Load Current: 6 Amps^[2]
Main Breaker Rating: 20 Amps/10,000 AIC^[2]
Power Supply: 200-240 VAC, 50/60 Hz, Single phase + GND^[4]
Power: 200-240 VAC, 50/60 Hz, single phase, full load 6 A, largest load 1.5 A^[4]
Power: 200-240 VAC, 50/60 Hz, 1 Phase + GND^[4]
Power: 200-240 VAC, 50/60 Hz^[2]

Wafer handling7

No robot^[4]
Wafer Sizes: 4, 6, 8 inch^[1]
Wafer sizes: 4 inch, 6 inch, 8 inch^[1]
Robot: Not present^[4]
Robot: No robot^[4]
Machine type: Automated Wafer, Die & Bump Inspection System^[3]
Wafer Sizes: 8 inch^[4]

Optics & imaging11

Objectives: 1, 2, 5, 20x^[1]; Laser focus sensor^[1]; Adimec inspection camera^[1]
Objectives: 1x, 2x, 5x, 20x^[1]
Inspection Cameras: Adimec inspection camera, Toshiba for color review^[1]
Focus Sensor: Laser focus sensor^[1]
Inspection Camera: Adimec^[1]
Color Review Camera: Toshiba^[1]
Laser Focus Sensor: Present^[1]
Inspection Camera: Adimec inspection camera^[1]
Laser Focus Sensor: Laser focus sensor^[1]

Control & software12

PC^[1]; NSK controller for theta^[1]
Theta Controller: NSK controller^[1]
Control Electronics: 1 Genesis main board, 3 Genesis Node board^[1]
Computer: PC^[1]
Motion System: Y-axis: worm screw; X-axis: linear; Theta: NSK controller^[1]
Control Computer: PC^[1]
Control Boards: 1 Genesis main board, 3 Genesis Node board^[1]
Theta controller: NSK^[1]
Motion System: Worm screw for Y, Linear for X, NSK controller for theta^[1]
Controller Boards: 1 genesis main board, 3 Genesis Node board^[1]
Theta: NSK controller for theta^[1]

Configuration & options34

Parts machine^[4]; Automatic Defect Inspection System^[2]
Power: 200-240 VAC^[2]; 50/60Hz^[2]
Largest Load: 1.5Amps^[2]; 1 Phase + GND^[2]; Ultraport top plate^[1]; Worm screw for Y^[1]; Linear for X^[1]; Toshiba for color review^[1]; 1 genesis main board^[1]; 3 Genesis Node board^[1]
System Type: Automatic Defect Inspection System^[2]
Phase Configuration: 1 Phase + GND^[2]
Known Vintage (example unit): 2008^[4]
Stage: Worm screw for Y, Linear for X^[1]
Full Load Current: 6 A^[4]
Largest Load Current: 1.5 A^[4]
Main Breaker: 20 A, 10,000 AIC^[2]
Year of Manufacture (one unit): 2008^[4]
Top plate: Ultraport^[1]
Genesis boards: 1 main board, 3 node boards^[1]
Motion: Y: worm screw, X: linear^[1]
Vintage: 2008^[4]
Type: Automatic Defect Inspection System^[2]
Color Review: Toshiba for color review^[1]
Ultraport Top Plate: Ultraport top plate^[1]
Model: NSX 105^[3]
Top plate: Ultraport top plate^[1]
X axis: Linear for X^[1]
Y axis: Worm screw for Y^[1]
Color review: Toshiba^[1]
Main board: 1 genesis main board^[1]
Node board: 3 Genesis Node board^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

ConfigurationSingle phase + GND^[4]
Configuration200-240 vac, 50/60 Hz^[4]
Full load6 amps^[4]
Largest load1.5 amps^[4]
Main Breaker20 Amps/10,000 AIC^[2]
Power Supply200-240 VAC, 50/60 Hz^[2]
Full Load Current6 Amps^[2]
Main Breaker Rating20 Amps/10,000 AIC^[2]
Power Supply200-240 VAC, 50/60 Hz, Single phase + GND^[4]
Power200-240 VAC, 50/60 Hz, single phase, full load 6 A, largest load 1.5 A^[4]
Power200-240 VAC, 50/60 Hz, 1 Phase + GND^[4]
Power200-240 VAC, 50/60 Hz^[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

Is the NSX 105 an automated system?

The NSX 105 is an automated inspection system.^[3]^[2]^[1]

Not publicly documented

The following facts about the NSX 105 Automated Wafer, Die & Bump are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NSX 105 Automated Wafer, Die & Bump are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the NSX 105 Automated Wafer, Die & Bump are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the NSX 105 Automated Wafer, Die & Bump are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NSX 105 Automated Wafer, Die & Bump are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the NSX 105 Automated Wafer, Die & Bump is not on record.
Answerable by: an OEM datasheet or a fab qualification report