Onto Innovation
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Onto Innovation NSX 115 Auto Defect is a metrology and inspection tool.[1]
An inspection system scans or images wafer surfaces and compares the observed features against expected patterns or reference conditions.
A defect inspection tool isolates particles, pattern irregularities, and other visible anomalies for review or process control.
The NSX 115 Auto Defect fits into in-line wafer inspection and metrology flows.
The NSX 115 Auto Defect is used before wafers move on to later fabrication steps that benefit from defect screening and process monitoring.
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The NSX 115 Auto Defect belongs to the metrology and inspection category.[1]
The following facts about the NSX 115 Auto Defect are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NSX 115 Auto Defect are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the NSX 115 Auto Defect are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the NSX 115 Auto Defect are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NSX 115 Auto Defect are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the NSX 115 Auto Defect is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 8, 2026.
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