3880-II

A die bonder is an automated assembly machine that picks semiconductor die from a wafer or tape and attaches them to a substrate or package using a bonding material such as epoxy, solder, or sintered paste. Die bonders are a key part of the semiconductor back-end packaging process, performing the die-attach step before wire bonding or encapsulation.

The Palomar 3880-II incorporates VisionPilot with Vision Standardization software that uses geometric pattern matching and calibrates images across different Palomar systems to ensure consistent alignment. The bonder features an automated tool changer that can hold up to eight tools in a turret for near-instant access. A high-force tool option supports up to 10 kg of bonding force while maintaining precision for low-force operations. Pulsed heat systems provide computer-controlled heating for solder-based applications. The 3880-II also includes a Bond Data Miner for data management and traceability, and an epoxy stamp station for repeatable dispensing.^[1][5][6][3]

The Palomar 3880-II is designed to handle a wide variety of components and assembly types, including chip-on-board, hybrid microcircuits, power modules, and optoelectronic devices. The machine supports multiple die-attach processes within the same platform, allowing a single machine to serve multiple package styles.^[1][5][6]

The Palomar 3880-II is suitable for applications including active optical cables, chip-on-board, CMOS sensors, GaN/GaAs MMIC, high-brightness/high-power LED assembly, high-power laser diodes, hybrid microcircuits, LiDAR, medical semiconductors and sensors, MEMS/MOEMS, microwave modules, power electronics, quantum computing, RF GaN power amplifiers, RF packages, and VCSEL, photodiode, DFB laser, and lens attach.^[1][5][6]

The 3880-II handles multiple bonding processes including epoxy die bonding, eutectic die bonding, UV die bonding, solder paste die attach, silver sintering, and thermocompression die bonding.^[1][5][6]