Palomar
9000
The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder driven by voice coil technology in the bond head. The Palomar 9000 Wedge Bonder has interchangeable 45-60° and 90° deep access wedge clamps and operates across a single large 304 x 152 mm work area. The Palomar 9000 Wedge Bonder's entire bond head mechanism rides on theta, providing excellent wire tension, a shorter wire feed path, and prevention of twisting of wire and ribbon.[1][2][3]
Plate 019000 Wedge Bonder overview
Palomar TechnologiesWatch on YouTubePlate 02Palomar 9000 High-Speed Fine Wire Wedge and Ribbon Bonder
Palomar TechnologiesWatch on YouTube
What it is
How it works
The Palomar 9000 uses voice coil technology in the bond head. The machine has interchangeable 45-60° and 90° deep access wedge clamps.[1][2][3]
The Palomar 9000 operates across a single large work area. The bond head mechanism rides on theta, which supports wire tension, shortens the wire feed path, and helps prevent twisting of wire and ribbon.[1][2][3]
Where it fits in the process flow
The Palomar 9000 is used in packaging and bonding operations. The machine supports wedge bonding, gold wire bonding, and aluminum wire bonding.[1][2][3]
Applications
The Palomar 9000 is applied to RF-SOE, disk drives, large complex hybrids, COB, RF and microwave devices, compact hybrids, fine pitch devices, low profile wire bonds, ribbon bonding, MCM power connections, running stitch interconnects, and high frequency passive and active components.[1][2][3]
- Disk drives
- Large complex hybrids
- RF and microwave devices
- Compact hybrids
- Fine pitch devices
- Low profile wire bonds
- Ribbon bonding
- MCM power connections
- Running stitch interconnects (die-to-die)
- High frequency passive and active components
What do the numbers mean?
Configuration & options6
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of bonds can this machine class make?General reference — not yet source-verified
Machines of this class can be configured for bonding methods that use heat, pressure, ultrasonic energy, or adhesive attachment, depending on the assembly task.
Why is precise control important in bonding equipment?General reference — not yet source-verified
Bond quality depends on alignment, contact conditions, and controlled application of energy or force, so repeatable motion and process control are essential.
Not publicly documented
The following facts about the 9000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 9000 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 9000 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 9000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 9000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 9000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
- [3]9000 Wedge Bonder — web.archive.orgweb.archive.org
Last updated Oct 5, 2026.
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